The influence of stacking fault energy on the microstructural and strain-hardening evolution of Fe–Mn–Al–Si steels during tensile deformation

2015 ◽  
Vol 100 ◽  
pp. 178-190 ◽  
Author(s):  
D.T. Pierce ◽  
J.A. Jiménez ◽  
J. Bentley ◽  
D. Raabe ◽  
J.E. Wittig
Keyword(s):  
Strain Hardening ◽  
Tensile Deformation ◽  
Stacking Fault ◽  
Stacking Fault Energy

scholarly journals Correlation of Grain Size, Stacking Fault Energy, and Texture in Cu-Al Alloys Deformed under Simulated Rolling Conditions

2015 ◽  
Vol 2015 ◽  
pp. 1-12 ◽  
Author(s):  
Ehab A. El-Danaf ◽  
Mahmoud S. Soliman ◽  
Ayman A. Al-Mutlaq
Keyword(s):  
Grain Size ◽  
Strain Hardening ◽  
Mechanical Twinning ◽  
Al Alloys ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Wide Range ◽  
Orientation Density ◽  
Pure Cu ◽  
Strain Hardening Rate

The effect of grain size and stacking fault energy (SFE) on the strain hardening rate behavior under plane strain compression (PSC) is investigated for pure Cu and binary Cu-Al alloys containing 1, 2, 4.7, and 7 wt. % Al. The alloys studied have a wide range of SFE from a low SFE of 4.5 mJm−2for Cu-7Al to a medium SFE of 78 mJm−2for pure Cu. A series of PSC tests have been conducted on these alloys for three average grain sizes of ~15, 70, and 250 μm. Strain hardening rate curves were obtained and a criterion relating twinning stress to grain size is established. It is concluded that the stress required for twinning initiation decreases with increasing grain size. Low values of SFE have an indirect influence on twinning stress by increasing the strain hardening rate which is reflected in building up the critical dislocation density needed to initiate mechanical twinning. A study on the effect of grain size on the intensity of the brass texture component for the low SFE alloys has revealed the reduction of the orientation density of that component with increasing grain size.

scholarly journals Characterization of Dislocation Rearrangement in FCC Metals during Work Hardening Using X-ray Diffraction Line-Profile Analysis

2020 ◽  
Vol 4 (4) ◽  
pp. 36
Author(s):  
Koutarou Nakagawa ◽  
Momoki Hayashi ◽  
Kozue Takano-Satoh ◽  
Hirotaka Matsunaga ◽  
Hiroyuki Mori ◽  
...  
Keyword(s):  
Grain Size ◽  
Dislocation Density ◽  
Line Profile ◽  
Cell Walls ◽  
Tensile Deformation ◽  
Profile Analysis ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Line Profile Analysis ◽  
Fcc Metals

Multiplication and rearrangement of dislocations in face-centered cubic (FCC) metals during tensile deformation are affected by grain size, stacking fault energy (SFE), and solute elements. X-ray diffraction (XRD) line-profile analysis can evaluate the dislocation density (ρ) and dislocation arrangement (M) from the strength of the interaction between dislocations. However, the relationship between M and ρ has not been thoroughly addressed. In this study, multiplication and rearrangement of dislocations in FCC metals during tensile deformation was evaluated by XRD line-profile analysis. Furthermore, the effects of grain size, SFE, and solute elements on the extent of dislocation rearrangement were evaluated with varying M values during tensile deformation. M decreased as the dislocation density increased. By contrast, grain size and SFE did not exhibit a significant influence on the obtained M values. The influence of solute species and concentration of solute elements on M changes were also determined. In addition, the relationship between dislocation substructures and M for tensile deformed metals were also explained. Dislocations were loosely distributed at M > 1, and cell walls gradually formed by gathering dislocations at M < 1. While cell walls became thicker with decreasing M in metals with low stacking fault energy, thin cell walls with high dislocation density formed for an M value of 0.3 in metals with high stacking fault energy.

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