scholarly journals Correlation of Grain Size, Stacking Fault Energy, and Texture in Cu-Al Alloys Deformed under Simulated Rolling Conditions

2015 ◽  
Vol 2015 ◽  
pp. 1-12 ◽  
Author(s):  
Ehab A. El-Danaf ◽  
Mahmoud S. Soliman ◽  
Ayman A. Al-Mutlaq

The effect of grain size and stacking fault energy (SFE) on the strain hardening rate behavior under plane strain compression (PSC) is investigated for pure Cu and binary Cu-Al alloys containing 1, 2, 4.7, and 7 wt. % Al. The alloys studied have a wide range of SFE from a low SFE of 4.5 mJm−2for Cu-7Al to a medium SFE of 78 mJm−2for pure Cu. A series of PSC tests have been conducted on these alloys for three average grain sizes of ~15, 70, and 250 μm. Strain hardening rate curves were obtained and a criterion relating twinning stress to grain size is established. It is concluded that the stress required for twinning initiation decreases with increasing grain size. Low values of SFE have an indirect influence on twinning stress by increasing the strain hardening rate which is reflected in building up the critical dislocation density needed to initiate mechanical twinning. A study on the effect of grain size on the intensity of the brass texture component for the low SFE alloys has revealed the reduction of the orientation density of that component with increasing grain size.

2016 ◽  
Vol 4 (2) ◽  
pp. 112-117 ◽  
Author(s):  
Yanzhong Tian ◽  
Akinobu Shibata ◽  
Zhefeng Zhang ◽  
Nobuhiro Tsuji

1999 ◽  
Vol 14 (10) ◽  
pp. 4044-4050 ◽  
Author(s):  
Shogo Komura ◽  
Zenji Horita ◽  
Minoru Nemoto ◽  
Terence G. Langdon

Equal-channel angular (ECA) pressing is a procedure having the capability of introducing an ultrafine grain size into a material. Experiments were conducted to examine the effect of the low stacking fault energy in pure Cu on microstructural development during ECA pressing at room temperature. The results show that the low 0stacking fault energy and the consequent low rate of recovery lead to a very slow evolution of the microstructure during pressing. Ultimately, a stable grain size of −0.27 μm was established in pure Cu but the microstructure was not fully homogeneous even after pressing to a total strain of ∼10. It is shown by static annealing that the as-pressed grains are stable up to ∼400 K, but at higher temperatures there is grain growth. These results lead to the conclusion that a low stacking fault energy is especially favorable for the introduction of an exceptionally small grain size using the ECA pressing procedure.


2019 ◽  
Vol 34 (13) ◽  
pp. 2398-2405
Author(s):  
Yusheng Li ◽  
Liangjuan Dai ◽  
Yang Cao ◽  
Yonghao Zhao ◽  
Yuntian Zhu

Abstract


2010 ◽  
Vol 667-669 ◽  
pp. 379-384 ◽  
Author(s):  
X.H. An ◽  
Shi Ding Wu ◽  
Z.F. Zhang

The microstructural evolution and grain refinement of Cu-Al alloys with different stacking fault energies (SFEs) processed by equal-channel angular pressing (ECAP) were investigated. The grain refinement mechanism was gradually transformed from dislocation subdivision to twin fragmentation with tailoring the SFE of Cu-Al alloys. Concurrent with the transition of grain refinement mechanism, the grain size can be refined into from ultrafine region (1 m~100 nm) to the nanoscale (<100 nm) and then it is found that the minimum equilibrium grain size decreases in a roughly linear way with lowering the SFE. Moreover, in combination with the previous results, it is proposed that the formation of a uniform ultrafine microstructure can be formed more readily in the materials with high SFE due to their high recovery rate of dislocations and in the materials with low SFE due to the easy formation of a homogeneously-twinned microstructure.


2007 ◽  
Vol 558-559 ◽  
pp. 1273-1278 ◽  
Author(s):  
Z. Horita ◽  
Kaoru Kishikawa ◽  
Keiichi Kimura ◽  
Kohei Tatsumi ◽  
Terence G. Langdon

Equal-channel angular pressing (ECAP) is a valuable technique for refining grain sizes to the submicrometer or the nanometer range. This study explores the reason for the difference in the grain refining behavior between pure Al and pure Cu. First, very high purity levels were adopted in order to minimize any effects of impurities: 99.999% for Al and 99.99999% for Cu. Second, high purity (99.999%) Au was also used in order to examine the effect of stacking fault energy. All three pure metals were subjected to ECAP and microstructural observations and hardness measurements were undertaken with respect to the number of ECAP passes. It is concluded that the stacking fault energy plays an important role and accounts for the difference in the grain refining behavior in the ECAP process.


Sign in / Sign up

Export Citation Format

Share Document