Elastic-modulus enhancement during room-temperature aging and its suppression in metastable Ti–Nb-Based alloys with low body-centered cubic phase stability

2016 ◽  
Vol 102 ◽  
pp. 373-384 ◽  
Author(s):  
M. Tane ◽  
K. Hagihara ◽  
M. Ueda ◽  
T. Nakano ◽  
Y. Okuda
Keyword(s):  
Elastic Modulus ◽  
Phase Stability ◽  
Room Temperature ◽  
Cubic Phase ◽  
Body Centered Cubic ◽  
Room Temperature Aging ◽  
Temperature Aging

scholarly journals Effects of Room Temperature Aging on Adhesion of Electroless Plating Film on Silicon Using Gold Nanoparticle Catalysts

2019 ◽  
Vol 70 (3) ◽  
pp. 174-176
Author(s):  
Yuichi TAKASAKA ◽  
Ryo FUJII ◽  
Naoki YAMADA ◽  
Naoki FUKUMURO ◽  
Susumu SAKAMOTO ◽  
...  
Keyword(s):  
Gold Nanoparticle ◽  
Electroless Plating ◽  
Room Temperature ◽  
Nanoparticle Catalysts ◽  
Room Temperature Aging ◽  
Temperature Aging

scholarly journals Effects of various pre-treatments and cold rolling on room temperature aging of 6000 series aluminum alloys

2009 ◽  
Vol 59 (5) ◽  
pp. 254-260
Author(s):  
Takahiko Nakamura ◽  
Kenji Muramatsu ◽  
Masanori Nagai ◽  
Ryouhei Otsu ◽  
Shin-ya Komatsu
Keyword(s):  
Aluminum Alloys ◽  
Cold Rolling ◽  
Room Temperature ◽  
Room Temperature Aging ◽  
Temperature Aging

Sn Whisker Growth in Cu(Top)-Sn(Bottom) Bilayer System upon Room Temperature Aging

2013 ◽  
Vol 785-786 ◽  
pp. 918-923 ◽  
Author(s):  
Lin Huang ◽  
Xue Nian Lin ◽  
Ren Wu Chen ◽  
Jiang Yong Wang
Keyword(s):  
Room Temperature ◽  
Whisker Growth ◽  
X Ray Diffraction ◽  
Sn Whisker ◽  
X Ray ◽  
Bilayer System ◽  
Room Temperature Aging ◽  
Sublayer Thickness ◽  
Temperature Aging ◽  
Scanning Electron

The Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging was investigated by scanning electron microscope and X-ray diffraction techniques. The experimental observations indicate that the Sn whisker growth on the Cu surface in Cu-Sn bilayer system is different from that on the Sn surface in Sn-Cu bilayer system. When the Sn sublayer thickness is less than 0.5μm, the Sn whisker growth can take place in Cu-Sn system but not in Sn-Cu system. An explanation for Sn whisker growth in Cu-Sn bilayer system is given.

scholarly journals On the room-temperature aging effects in YBa 2 Cu 3 O 6+δ

2015 ◽  
Vol 515 ◽  
pp. 54-61 ◽  
Author(s):  
А.V. Fetisov ◽  
G.А. Kozhina ◽  
S.Kh. Estemirova ◽  
V.Ya. Mitrofanov
Keyword(s):  
Room Temperature ◽  
Aging Effects ◽  
Room Temperature Aging ◽  
Temperature Aging

Critical factors that determine face-centered cubic to body-centered cubic phase transformation in sputter-deposited austenitic stainless steel films

2004 ◽  
Vol 19 (6) ◽  
pp. 1696-1702 ◽  
Author(s):  
X. Zhang ◽  
A. Misra ◽  
R.K. Schulze ◽  
C.J. Wetteland ◽  
H. Wang ◽  
...  
Keyword(s):  
Thin Films ◽  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Phase Stability ◽  
Cubic Phase ◽  
Face Centered Cubic ◽  
Body Centered Cubic ◽  
Bcc Structure ◽  
Face Centered ◽  
Sputter Deposited

Bulk austenitic stainless steels (SS) have a face-centered cubic (fcc) structure. However, sputter deposited films synthesized using austenitic stainless steel targets usually exhibit body-centered cubic (bcc) structure or a mixture of fcc and bcc phases. This paper presents studies on the effect of processing parameters on the phase stability of 304 and 330 SS thin films. The 304 SS thin films with in-plane, biaxial residual stresses in the range of approximately 1 GPa (tensile) to approximately 300 MPa (compressive) exhibited only bcc structure. The retention of bcc 304 SS after high-temperature annealing followed by slow furnace cooling indicates depletion of Ni in as-sputtered 304 SS films. The 330 SS films sputtered at room temperature possess pure fcc phase. The Ni content and the substrate temperature during deposition are crucial factors in determining the phase stability in sputter deposited austenitic SS films.

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