Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects
2020 ◽
Vol 188
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pp. 241-258
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A. Durga
◽
P. Wollants
◽
N. Moelans
A. Durga
◽
P. Wollants
◽
N. Moelans
Shui-Bao Liang
◽
Chang-Bo Ke
◽
Cheng Wei
◽
Min-Bo Zhou
◽
Xin-Ping Zhang
2020 ◽
Vol 861
◽
pp. 012072
B Böttger
◽
M Apel
◽
T Jokisch
◽
A Senger
Shuibao Liang
◽
Cheng Wei
◽
Changbo Ke
Fei Wang
◽
Lorenz Ratke
◽
Haodong Zhang
◽
Patrick Altschuh
◽
Britta Nestler
2019 ◽
Vol 132
◽
pp. 236-243
Rupesh Chafle
◽
Somnath Bhowmick
◽
Rajdip Mukherjee
2014 ◽
Vol 72
◽
pp. 200-210
◽
Maeva Cottura
◽
Benoît Appolaire
◽
Alphonse Finel
◽
Yann Le Bouar
2008 ◽
Vol 17
(9)
◽
pp. 3523-3530
◽
Zhang Yu-Xiang
◽
Wang Jin-Cheng
◽
Yang Yu-Juan
◽
Yang Gen-Cang
◽
Zhou Yao-He
2014 ◽
Vol 49
(10)
◽
pp. 3642-3651
◽
Hemantha Kumar Yeddu
◽
Turab Lookman
◽
Avadh Saxena
Bo Xu
◽
Chao Yu
◽
Guozheng Kang