Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

2018 ◽  
Author(s):  
Shui-Bao Liang ◽  
Chang-Bo Ke ◽  
Cheng Wei ◽  
Min-Bo Zhou ◽  
Xin-Ping Zhang
Keyword(s):  
Temperature Gradient ◽  
Physical Properties ◽  
Field Study ◽  
Electric Current ◽  
Phase Field ◽  
Solder Joints ◽  
Phase Segregation ◽  
Combined Effects ◽  
Current Stressing

scholarly journals Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects

2020 ◽  
Vol 188 ◽  
pp. 241-258 ◽  
Author(s):  
A. Durga ◽  
P. Wollants ◽  
N. Moelans
Keyword(s):  
Field Study ◽  
Phase Field ◽  
Solder Joints

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

2003 ◽  
Vol 82 (7) ◽  
pp. 1045-1047 ◽  
Author(s):  
Hua Ye ◽  
Cemal Basaran ◽  
Douglas Hopkins
Keyword(s):  
Electric Current ◽  
Joule Heating ◽  
Solder Joints ◽  
Current Stressing

Phase-field study on geometry-dependent migration behavior of voids under temperature gradient in UO2 crystal matrix

2017 ◽  
Vol 122 (15) ◽  
pp. 154102 ◽  
Author(s):  
Weijin Chen ◽  
Yuyi Peng ◽  
Xu'an Li ◽  
Kelang Chen ◽  
Jun Ma ◽  
...  
Keyword(s):  
Temperature Gradient ◽  
Field Study ◽  
Phase Field ◽  
Migration Behavior ◽  
Crystal Matrix
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