Phase-field study for the splitting behaviour of precipitate under applied stress

2008 ◽  
Vol 17 (9) ◽  
pp. 3523-3530 ◽  
Author(s):  
Zhang Yu-Xiang ◽  
Wang Jin-Cheng ◽  
Yang Yu-Juan ◽  
Yang Gen-Cang ◽  
Zhou Yao-He
2013 ◽  
Vol 29 (10) ◽  
pp. 999-1004 ◽  
Author(s):  
Yanli Lu ◽  
Liuchao Zhang ◽  
Yingying Zhou ◽  
Zheng Chen ◽  
Jianguo Zhang

2019 ◽  
Vol 132 ◽  
pp. 236-243
Author(s):  
Rupesh Chafle ◽  
Somnath Bhowmick ◽  
Rajdip Mukherjee

2014 ◽  
Vol 72 ◽  
pp. 200-210 ◽  
Author(s):  
Maeva Cottura ◽  
Benoît Appolaire ◽  
Alphonse Finel ◽  
Yann Le Bouar
Keyword(s):  

2014 ◽  
Vol 49 (10) ◽  
pp. 3642-3651 ◽  
Author(s):  
Hemantha Kumar Yeddu ◽  
Turab Lookman ◽  
Avadh Saxena

Materials ◽  
2018 ◽  
Vol 11 (10) ◽  
pp. 1903 ◽  
Author(s):  
Yuhao Song ◽  
Mingtao Wang ◽  
Yaping Zong ◽  
Ri He ◽  
Jianfeng Jin

Based on the principle of grain refinement caused by the second-phase particles, a phase field model was built to describe the recrystallization process in the ZK60 alloy system with Y added under applied stress between temperatures 573 and 673 K for 140 min duration. The simulation of grain growth with second phase particles and applied stress during annealing process on industrial scale on the condition of real time-space was achieved. Quantitative analysis was carried out and some useful laws were revealed in ZK60 alloy system. The second phase particles had a promoting effect on the grain refinement, however the effect weakened significantly when the content exceeded 1.5%. Our simulation results reveal the existence of a critical range of second phase particle size of 0.3–0.4 μm, within which a microstructure of fine grains can be obtained. Applied stress increased the grain coarsening rate significantly when the stress was more than 135 MPa. The critical size of the second phase particles was 0.4–0.75 μm when the applied stress was 135 MPa. Finally, a microstructure with a grain size of 11.8–13.8 μm on average could be obtained when the second phase particles had a content of 1.5% and a size of 0.4–0.75 μm with an applied stress less than 135 Mpa after 30 min annealing at 573 K.


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