scholarly journals In-situ X-ray radiography of primary Fe-rich intermetallic compound formation

2020 ◽  
Vol 196 ◽  
pp. 759-769
Author(s):  
Shikang Feng ◽  
Enzo Liotti ◽  
Andrew Lui ◽  
Matthew D. Wilson ◽  
Thomas Connolley ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
X Ray ◽  
Intermetallic Compound Formation

Intermetallic Compound Formation on Solder Alloy/Cu-Substrate Interface Using Lead-Free Sn-0.7Cu/Recycled-Aluminum Composite Solder

2012 ◽  
Vol 620 ◽  
pp. 105-111 ◽  
Author(s):  
Flora Somidin ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Rafezi Ahmad Khairel
Keyword(s):  
Intermetallic Compound ◽  
Composite Solder ◽  
Lead Free ◽  
X Ray Diffraction ◽  
Aluminum Composite ◽  
Compound Formation ◽  
Cu Substrate ◽  
X Ray ◽  
Intermetallic Compound Formation ◽  
Solder Composite

Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper focuses on the intermetallic compound (IMC) formation study between the fabricated solder composite on Cu-substrate. Throughout this study, four different composition of Sn-0.7Cu/re-Al (0.0, 3.0, 3.5, 4.0 wt.%) were studied. X-ray diffraction (XRD) was used to analyze the IMCs phase formation between the interfaces. New IMC phase of Cu9Al4was detected beside Cu6Sn5and Cu3Sn in the composite solder samples. However, Sn-0.7Cu/3.0re-Al showed least formation of brittle IMCs compared to the monolithic solder.

Microscopic study of intermetallic compound formation by in situ method

2009 ◽  
Vol 49 (2) ◽  
pp. 22905
Author(s):  
H. Gauthier ◽  
P. Hovington ◽  
M. Lagacé ◽  
P. Noël ◽  
A. Lapointe ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Microscopic Study ◽  
Compound Formation ◽  
In Situ Method ◽  
Intermetallic Compound Formation

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation

Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition

1998 ◽  
Vol 13 (1) ◽  
pp. 37-44 ◽  
Author(s):  
C. Y. Liu ◽  
K. N. Tu
Keyword(s):  
Free Energy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Driving Force ◽  
Alloy Composition ◽  
Wetting Angle ◽  
Compound Formation ◽  
Side Band ◽  
Intermetallic Compound Formation ◽  
Pure Sn

We have investigated the wetting angle, side band growth, and intermetallic compound formation of seven SnPb alloys on Cu ranging from pure Sn to pure Pb. The wetting angle has a minimum near the middle composition and increases toward pure Sn and pure Pb, but the side band growth has a maximum near the middle composition. The intermetallic compounds formed are Cu6Sn5 and Cu3Sn for the eutectic and high-Sn alloys, yet for the high-Pb alloys, only Cu3Sn can be detected. While no intermetallic compound forms between Cu and pure Pb, the latter nevertheless wets the former with an angle of 115°. The driving force of a wetting reaction, which may be affected by the free energy gain in compound formation, is discussed by assuming that rate of compound formation is fast.

Relationship between intermetallic compound formation and glass forming ability of Al–Ni–La alloy

2003 ◽  
Vol 319 (3-4) ◽  
pp. 424-428 ◽  
Author(s):  
Pengchao Si ◽  
Xiufang Bian ◽  
Wang Li ◽  
Junyan Zhang ◽  
Zhongxi Yang
Keyword(s):  
Intermetallic Compound ◽  
Glass Forming Ability ◽  
Compound Formation ◽  
Glass Forming ◽  
Intermetallic Compound Formation
Sign in / Sign up

Export Citation Format

Share Document