Experimental results of an activated carbon–HFC 134a adsorption cooling system for thermal management of electronics

2011 ◽  
Vol 31 (10) ◽  
pp. 1607-1612 ◽  
Author(s):  
N.D. Banker ◽  
M. Prasad ◽  
P. Dutta ◽  
K. Srinivasan
Keyword(s):  
Activated Carbon ◽  
Thermal Management ◽  
Cooling System ◽  
Experimental Results ◽  
Hfc 134A ◽  
Thermal Management Of Electronics ◽  
Adsorption Cooling System

scholarly journals Numerical Investigation of Small-Scale Adsorption Cooling System Performance Employing Activated Carbon-Ethanol Pair

Energies ◽  
2018 ◽  
Vol 11 (6) ◽  
pp. 1499 ◽  
Author(s):  
Marzia Khanam ◽  
Skander Jribi ◽  
Takahiko Miyazaki ◽  
Bidyut Saha ◽  
Shigeru Koyama
Keyword(s):  
Activated Carbon ◽  
Numerical Investigation ◽  
System Performance ◽  
Cooling System ◽  
Small Scale ◽  
Adsorption Cooling System

Liquid Metal Alloy Based Vascular-Like Microchannel Networks for the Thermal Management of Electronics

2014 ◽  
Author(s):  
Zhi-Zhu He ◽  
Xu Xue ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Thermal Management ◽  
High Efficiency ◽  
Cooling System ◽  
Metal Alloy ◽  
Outlet Channel ◽  
Thermal Management System ◽  
Thermal Management Of Electronics ◽  
Liquid Metal Alloy

In this paper, the heat transfer and hydrodynamics of the liquid metal alloy in the vascular-like microchannel networks based cooling system are numerically investigated and compared with the corresponding coolant by water. The whole microchannel networks are composed of two vascular-like networks which are vertically connected with each other. Each vascular-like network has a single inlet or outlet channel, and uniformly bifurcates over many distributed levels’ microchannels. The vascular-like networks combined with liquid metal alloy are used to design the high efficiency thermal management system for Electronics.

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