Cooling performance and space efficiency improvement based on heat sink arrangement for power conversion electronics

2020 ◽  
Vol 164 ◽  
pp. 114458
Author(s):  
Youngchan Yoon ◽  
Dong Rip Kim ◽  
Kwan-Soo Lee
Keyword(s):  
Heat Sink ◽  
Power Conversion ◽  
Efficiency Improvement ◽  
Cooling Performance ◽  
Space Efficiency

Cooling Performance Analysis of Heat Sink

2011 ◽  
Vol 1 (9) ◽  
pp. 65-67
Author(s):  
Pritesh S Patel ◽  
◽  
Prof. Dattatraya G Subhedar ◽  
Prof. Kamlesh V Chauhan
Keyword(s):  
Performance Analysis ◽  
Heat Sink ◽  
Cooling Performance

Thermal performance of a phase change material-based heat sink in presence of nanoparticles and metal-foam to enhance cooling performance of electronics

2022 ◽  
Vol 48 ◽  
pp. 103882
Author(s):  
Adeel Arshad ◽  
Mark Jabbal ◽  
Hamza Faraji ◽  
Pouyan Talebizadehsardari ◽  
Muhammad Anser Bashir ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Performance ◽  
Heat Sink ◽  
Metal Foam ◽  
Cooling Performance ◽  
Change Material

scholarly journals Cooling Performance of a Novel Circulatory Flow Concentric Multi-Channel Heat Sink with Nanofluids

Nanomaterials ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 647 ◽  
Author(s):  
Ravindra Jilte ◽  
Mohammad H. Ahmadi ◽  
Ravinder Kumar ◽  
Vilas Kalamkar ◽  
Amirhosein Mosavi
Keyword(s):  
Heat Sink ◽  
Volume Fraction ◽  
Removal Rate ◽  
Heat Removal ◽  
High Heat ◽  
Operating Conditions ◽  
Bottom Surface ◽  
Outlet Temperature ◽  
Cooling Performance ◽  
Heat Rejection

Heat rejection from electronic devices such as processors necessitates a high heat removal rate. The present study focuses on liquid-cooled novel heat sink geometry made from four channels (width 4 mm and depth 3.5 mm) configured in a concentric shape with alternate flow passages (slot of 3 mm gap). In this study, the cooling performance of the heat sink was tested under simulated controlled conditions.The lower bottom surface of the heat sink was heated at a constant heat flux condition based on dissipated power of 50 W and 70 W. The computations were carried out for different volume fractions of nanoparticles, namely 0.5% to 5%, and water as base fluid at a flow rate of 30 to 180 mL/min. The results showed a higher rate of heat rejection from the nanofluid cooled heat sink compared with water. The enhancement in performance was analyzed with the help of a temperature difference of nanofluid outlet temperature and water outlet temperature under similar operating conditions. The enhancement was ~2% for 0.5% volume fraction nanofluids and ~17% for a 5% volume fraction.

Influence of fan setting height on the cooling performance of a plate-fin-type heat sink with microprocessor

2001 ◽  
Vol 30 (6) ◽  
pp. 512-520 ◽  
Author(s):  
Keizou Kawamura ◽  
Tadakatsu Nakajima ◽  
Hitoshi Matsushima
Keyword(s):  
Heat Sink ◽  
Cooling Performance

Cooling performance of a nanofluid flow in a heat sink microchannel with axial conduction effect

2014 ◽  
Vol 117 (4) ◽  
pp. 1821-1833 ◽  
Author(s):  
M. Izadi ◽  
M. M. Shahmardan ◽  
M. Norouzi ◽  
A. M. Rashidi ◽  
A. Behzadmehr
Keyword(s):  
Heat Sink ◽  
Nanofluid Flow ◽  
Cooling Performance ◽  
Axial Conduction
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