Tetramethyl ammonium hydroxide production using the microbial electrolysis desalination and chemical-production cell with long anode

2018 ◽  
Vol 251 ◽  
pp. 403-406 ◽  
Author(s):  
Bo Ye ◽  
Yaobin Lu ◽  
Haiping Luo ◽  
Guangli Liu ◽  
Renduo Zhang
2012 ◽  
Vol 116 ◽  
pp. 507-511 ◽  
Author(s):  
Shanshan Chen ◽  
Guangli Liu ◽  
Renduo Zhang ◽  
Bangyu Qin ◽  
Yong Luo ◽  
...  

2019 ◽  
Vol 273 ◽  
pp. 71-76 ◽  
Author(s):  
Daniélen dos Santos Silva ◽  
Carine Souza dos Santos ◽  
Luzia Aparecida Pando ◽  
Mário Sérgio Rocha Gomes ◽  
Cleber Galvão Novaes ◽  
...  

2012 ◽  
Vol 30 (7) ◽  
pp. 724-734 ◽  
Author(s):  
Syouhei Nishihama ◽  
Miuki Murakami ◽  
Naoko Y. Igarashi ◽  
Katsutoshi Yamamoto ◽  
Kazuharu Yoshizuka

1996 ◽  
Vol 74 (S1) ◽  
pp. 79-84 ◽  
Author(s):  
S. Naseh ◽  
L. M. Landsberger ◽  
M. Kahrizi ◽  
M. Paranjape

Anisotropic etching of silicon in tetramethyl ammonium hydroxide (TMAH) is receiving attention as a relatively nontoxic alternative anisotropic etchant for silicon (Si), for the fabrication of microelectromechanical systems, sensors, and actuators. This work presents experimental investigations on several aspects of anisotropic etching of Si in TMAH. The effects of temperature and concentration on etch rates of {100} and {110} wafers are characterized. Several previously unreported experimental findings aimed at better understanding the atomic level mechanisms are presented: underetch-rate variation with mask-edge deviation, an investigation of stirring, and a subtle effect of applied bending stress.


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