Conduction mechanisms in porous Si LEDs

2006 ◽  
Vol 6 (2) ◽  
pp. 174-178 ◽  
Author(s):  
Béla Szentpáli ◽  
Tibor Mohácsy ◽  
István Bársony

2008 ◽  
Vol 23 (4) ◽  
pp. 769-773 ◽  
Author(s):  
Shu-Bin WANG
Keyword(s):  


2008 ◽  
Vol 23 (4) ◽  
pp. 763-768 ◽  
Author(s):  
Min LUO


2021 ◽  
Vol 16 (1) ◽  
Author(s):  
Yijie Li ◽  
Nguyen Van Toan ◽  
Zhuqing Wang ◽  
Khairul Fadzli Bin Samat ◽  
Takahito Ono

AbstractPorous silicon (Si) is a low thermal conductivity material, which has high potential for thermoelectric devices. However, low output performance of porous Si hinders the development of thermoelectric performance due to low electrical conductivity. The large contact resistance from nonlinear contact between porous Si and metal is one reason for the reduction of electrical conductivity. In this paper, p- and n-type porous Si were formed on Si substrate by metal-assisted chemical etching. To decrease contact resistance, p- and n-type spin on dopants are employed to dope an impurity element into p- and n-type porous Si surface, respectively. Compared to the Si substrate with undoped porous samples, ohmic contact can be obtained, and the electrical conductivity of doped p- and n-type porous Si can be improved to 1160 and 1390 S/m, respectively. Compared with the Si substrate, the special contact resistances for the doped p- and n-type porous Si layer decreases to 1.35 and 1.16 mΩ/cm2, respectively, by increasing the carrier concentration. However, the increase of the carrier concentration induces the decline of the Seebeck coefficient for p- and n-type Si substrates with doped porous Si samples to 491 and 480 μV/K, respectively. Power factor is related to the Seebeck coefficient and electrical conductivity of thermoelectric material, which is one vital factor that evaluates its output performance. Therefore, even though the Seebeck coefficient values of Si substrates with doped porous Si samples decrease, the doped porous Si layer can improve the power factor compared to undoped samples due to the enhancement of electrical conductivity, which facilitates its development for thermoelectric application.



AIP Advances ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 065305
Author(s):  
Alexandre Juneau-Fecteau ◽  
Rémy Savin ◽  
Abderraouf Boucherif ◽  
Luc G. Fréchette
Keyword(s):  


Materials ◽  
2021 ◽  
Vol 14 (16) ◽  
pp. 4385
Author(s):  
Ehsan Raza ◽  
Fakhra Aziz ◽  
Arti Mishra ◽  
Noora Jabor Al-Thani ◽  
Zubair Ahmad

The current work proposed the application of methylammonium lead iodide (MAPbI3) perovskite microrods toward photo resistor switches. A metal-semiconductor-metal (MSM) configuration with a structure of silver-MAPbI3(rods)-silver (Ag/MAPbI3/Ag) based photo-resistor was fabricated. The MAPbI3 microrods were prepared by adopting a facile low-temperature solution process, and then an independent MAPbI3 microrod was employed to the two-terminal device. The morphological and elemental compositional studies of the fabricated MAPbI3 microrods were performed using FESEM and EDS, respectively. The voltage-dependent electrical behavior and electronic conduction mechanisms of the fabricated photo-resistors were studied using current–voltage (I–V) characteristics. Different conduction mechanisms were observed at different voltage ranges in dark and under illumination. In dark conditions, the conduction behavior was dominated by typical trap-controlled charge transport mechanisms within the investigated voltage range. However, under illumination, the carrier transport is dominated by the current photogenerated mechanism. This study could extend the promising application of perovskite microrods in photo-induced resistor switches and beyond.



2021 ◽  
Vol 266 ◽  
pp. 115035
Author(s):  
S. Moussa ◽  
F. Namouchi ◽  
H. Guermazi ◽  
S. Guermazi


2015 ◽  
Vol 161 ◽  
pp. 408-412 ◽  
Author(s):  
Chunli Li ◽  
Ping Zhang ◽  
Zhiyu Jiang
Keyword(s):  


1995 ◽  
Vol 66 (21) ◽  
pp. 2912-2913 ◽  
Author(s):  
M. Davison ◽  
K. P. O’Donnell ◽  
U. M. Noor ◽  
D. Uttamchandani ◽  
L. E. A. Berlouis


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