Abstract
High-temperature oxidation resistance, hot formability, element distribution, and microstructure of Al-10% Si-(0.5–3.0%)Cu coating were investigated by means of glow discharge spectroscopy, optical microscope, scanning electron microscope, and energy-dispersive spectroscopy. Results show that the addition of Cu can increase high-temperature oxidation resistance above 950°C and improve hot formability so that no crack spreads into substrate steel as hot forming at 33.3% strain. Oxidation film structure is continual and compacting, and Si highly concentrates in the surface layer. The distribution of Cu has skin effect with peaking content 8.2% in the surface layer. After hot stamping, Al and Si diffuse into substrate steel, and Cu diffuses from inner to outer coating. Al–Si–Cu coating has smoother surface, straighter diffusion layer, and finer metal compound than Al–Si coating. Surface and diffusion layers are identified as aluminum oxide, Si-rich, and Cu phase and Al7SiFe2, Al3Fe, and CuAl3, respectively. Al-rich phase and the metal compound are composed of α-Al dissolving Fe, Si, and Cu and Al–Si matrix, Cu3Al, respectively.
High Temperature Oxidation Behavior of N2+ Ion Implanted Pure Titanium in Air and Water Vapor
