Constructing Tanghulu-like Diamond@Silicon carbide nanowires for enhanced thermal conductivity of polymer composite

2021 ◽  
pp. 101008
Author(s):  
Yue Qin ◽  
Bo Wang ◽  
Xiao Hou ◽  
Linhong Li ◽  
Chunlong Guan ◽  
...  
2015 ◽  
Vol 3 (9) ◽  
pp. 4884-4891 ◽  
Author(s):  
Wen Dai ◽  
Jinhong Yu ◽  
Yi Wang ◽  
Yingze Song ◽  
Fakhr E. Alam ◽  
...  

3DSG incorporated into a polyimide matrix greatly enhanced its thermal conductivity (up to 2.63 W m−1 K−1), approximately a 10-fold enhancement in comparison with that of neat polyimide.


RSC Advances ◽  
2017 ◽  
Vol 7 (73) ◽  
pp. 46306-46312 ◽  
Author(s):  
Na Song ◽  
Haidong Pan ◽  
Xingshuang Hou ◽  
Siqi Cui ◽  
Liyi Shi ◽  
...  

It is urgent to manufacture a polymer composite that has high thermal conductivity (especially in the through-plane direction) and mechanical properties simultaneously to meet the heat dissipation requirement of electronic devices.


2018 ◽  
Vol 160 ◽  
pp. 127-137 ◽  
Author(s):  
Jiantao Hu ◽  
Yun Huang ◽  
Xiaoliang Zeng ◽  
Qiang Li ◽  
Linlin Ren ◽  
...  

2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Dianyu Shen ◽  
Zhaolin Zhan ◽  
Zhiduo Liu ◽  
Yong Cao ◽  
Li Zhou ◽  
...  

2019 ◽  
Vol 11 (47) ◽  
pp. 44700-44707 ◽  
Author(s):  
Yuming Wu ◽  
Kai Ye ◽  
Zhiduo Liu ◽  
Bo Wang ◽  
Chao Yan ◽  
...  

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