scholarly journals Enhancement of thermal conductivity in polyamide-6/graphene composites via a “bridge effect” of silicon carbide whiskers

RSC Advances ◽  
2017 ◽  
Vol 7 (73) ◽  
pp. 46306-46312 ◽  
Author(s):  
Na Song ◽  
Haidong Pan ◽  
Xingshuang Hou ◽  
Siqi Cui ◽  
Liyi Shi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Polymer Composite ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Polyamide 6 ◽  
High Thermal Conductivity ◽  
Silicon Carbide Whiskers ◽  
Plane Direction

It is urgent to manufacture a polymer composite that has high thermal conductivity (especially in the through-plane direction) and mechanical properties simultaneously to meet the heat dissipation requirement of electronic devices.

Highly Thermoconductive Yet Ultraflexible Polymer Composite with Superior Mechanical Properties and Autonomous Self-Healing Functionality via Binary Fillers Strategy

2022 ◽  
Author(s):  
Dong Wang ◽  
Dingyao Liu ◽  
JianHua Xu ◽  
JiaJun Fu ◽  
Kai Wu
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Polymer Composite ◽  
High Thermal Conductivity ◽  
Thermal Dissipation ◽  
Self Healing ◽  
Formidable Challenge ◽  
Superior Mechanical Properties

It is still a formidable challenge to develop ideal thermal dissipation materials with simultaneous high thermal conductivity, excellent mechanical softness and toughness, and spontaneous self-healing. Herein, we report the introduction...

High thermal conductivity liquid metal pad for heat dissipation in electronic devices

2018 ◽  
Vol 124 (5) ◽  
Author(s):  
Zuoye Lin ◽  
Huiqiang Liu ◽  
Qiuguo Li ◽  
Han Liu ◽  
Sheng Chu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
High Thermal Conductivity

Mechanical and Heat Transfer Performance Investigation of High Thermal Conductivity, Commercially Available Polymer Composite Materials for Heat Exchange in Electronic Systems

2017 ◽  
Vol 9 (3) ◽  
Author(s):  
Peter Rodgers ◽  
Valerie Eveloy ◽  
Antoine Diana ◽  
Ismail Darawsheh ◽  
Fahad Almaskari
Keyword(s):  
Heat Transfer ◽  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Mechanical Property ◽  
Heat Exchange ◽  
Polymer Composite ◽  
Flexural Modulus ◽  
Morphological Characteristics ◽  
Composite Fiber ◽  
High Thermal Conductivity

The thermal, mechanical, and morphological characteristics of three selected commercially available, injection-moldable, high thermal conductivity (20–32 W/m K), polyimide 66 (PA66) polymer composites from two vendors are characterized for possible heat exchange applications in electronic equipment. The fillers are found to consist of 10 μm diameter, 120–350 μm long fibers, made of carbon in two composites, and a hybrid combination of essentially carbon, oxygen, and silicon in the third composite. Fiber weight loading ranges from 63% to 69%. The hybrid, high-length fiber-reinforced material overall displays superior mechanical properties (i.e., ultimate tensile, flexural and impact strengths, and flexural modulus) compared with the other two carbon-filled composites. For the hybrid-filled and one carbon-filled material (both having a thermal conductivity of 20 W/m K), good agreement between mechanical property measurements and corresponding vendor data is obtained. For the material having the highest vendor-specified thermal conductivity (i.e., 32 W/m K) and weight filler fraction (i.e., 69%), mechanical properties are up to 37% lower than corresponding vendor data. The heat transfer rates of parallel plate, cross-flow air–water heat exchanger prototypes made of the three PA66 materials are comparable to that of an aluminum prototype having the same geometry. Based on the combined heat transfer and mechanical property characterization results, the hybrid, long fiber-filled PA66 polymer composite appears to have the best combination of mechanical and heat transfer characteristics, for potential use in electronics heat exchange applications.

scholarly journals Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride

Polymers ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 597 ◽  
Author(s):  
Van-Dung Mai ◽  
Dae-Il Lee ◽  
Jun-Hong Park ◽  
Dai-Soo Lee
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Electronic Packaging ◽  
Epoxy Resins ◽  
Heat Dissipation ◽  
Filler Content ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Packaging Materials ◽  
Thermally Conductive

Electronic packaging materials with high thermal conductivity and suitable viscosity are necessary in the manufacturing of highly integrated electronic devices for efficient heat dissipation during operation. This study looked at the effect of boron nitride (BN) platelets on the rheology and thermal conductivity of composites based on alumina (Al2O3) and epoxy resin (EP) for the potential application as electronic packaging. The viscosity and thermal conductivity of the composite were increased upon increasing filler content. Furthermore, thermal conductivity of the BN/Al2O3/EP was much higher than that of Al2O3/EP at almost the same filler loadings. These unique properties resulted from the high thermal conductivity of the BN and the synergistic effect of the spherical and plate shapes of these two fillers. The orientation of BN platelets can be controlled by adjusting their loading to facilitate the formation of higher thermally conductive pathways. The optimal content of the BN in the Al2O3/EP composites was confirmed to be 5.3 vol %, along with the maximum thermal conductivity of 4.4 W/(m·K).

Constructing Tanghulu-like Diamond@Silicon carbide nanowires for enhanced thermal conductivity of polymer composite

2021 ◽  
pp. 101008
Author(s):  
Yue Qin ◽  
Bo Wang ◽  
Xiao Hou ◽  
Linhong Li ◽  
Chunlong Guan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Polymer Composite ◽  
Enhanced Thermal Conductivity

scholarly journals Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Filler Loading ◽  
High Thermal Conductivity ◽  
Heat Diffusion ◽  
Composite Powders ◽  
Polyurethane Composite ◽  
Uniform Dispersion ◽  
Thermally Conductive

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

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