scholarly journals Finite element analysis of the grain size effect on diffusion in polycrystalline materials

2014 ◽  
Vol 95 ◽  
pp. 187-191 ◽  
Author(s):  
V. Lacaille ◽  
C. Morel ◽  
E. Feulvarch ◽  
G. Kermouche ◽  
J.-M. Bergheau
Keyword(s):  
Finite Element Analysis ◽  
Grain Size ◽  
Finite Element ◽  
Size Effect ◽  
Polycrystalline Materials ◽  
Grain Size Effect ◽  
Element Analysis

Finite Element Analysis of Mesh Size Effect of 3D Angle-Interlock Woven Composites Using Voxel-Based Method

2018 ◽  
Vol 25 (4) ◽  
pp. 905-920 ◽  
Author(s):  
Diantang Zhang ◽  
Guyu Feng ◽  
Mengyao Sun ◽  
Song Yu ◽  
Yuanhui Gu ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Size Effect ◽  
Mesh Size ◽  
Woven Composites ◽  
Element Analysis

Scatter prediction and size effect of ceramics strength by finite element analysis

2018 ◽  
Vol 2018 (0) ◽  
pp. S0420101
Author(s):  
Kyohei TAKEO ◽  
Yuya AOKI ◽  
Toshio OSADA ◽  
Wataru NAKAO ◽  
Shingo OZAKI
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Size Effect ◽  
Element Analysis

Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects

2015 ◽  
Vol 12 (3) ◽  
pp. 118-122 ◽  
Author(s):  
Tengfei Jiang ◽  
Chenglin Wu ◽  
Jay Im ◽  
Rui Huang ◽  
Paul S. Ho
Keyword(s):  
Mechanical Properties ◽  
Finite Element Analysis ◽  
Grain Size ◽  
Finite Element ◽  
Analytical Model ◽  
Material Properties ◽  
Grain Structure ◽  
Element Analysis ◽  
Silicon Vias ◽  
The Relationship

In this article, the effects of Cu microstructure on the mechanical properties and extrusion of through-silicon vias (TSVs) were studied based on two types of TSVs with different microstructure. A direct correlation was found between the grain size and the mechanical properties of the vias. Both an analytical model and finite element analysis (FEA) were used to establish the relationship between the mechanical properties and via extrusion. The effect of via/Si interface on extrusion was also studied by FEA. The results suggest small and uniform grains in the Cu vias, as well as stronger interfaces between the via and Si led to smaller via extrusion, and are thus preferable for reduced via extrusion failure and improved TSV reliability.

scholarly journals Finite Element Analysis of the Size Effect on Ceramic Strength

Materials ◽  
2019 ◽  
Vol 12 (18) ◽  
pp. 2885 ◽  
Author(s):  
Kyohei Takeo ◽  
Yuya Aoki ◽  
Toshio Osada ◽  
Wataru Nakao ◽  
Shingo Ozaki
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Size Effect ◽  
Damage Model ◽  
Fracture Probability ◽  
Element Analysis ◽  
Weibull Statistics ◽  
Weakest Link ◽  
The Finite Element Analysis ◽  
The Relationship

The most prominent effect of the weakest link theory, which is used to derive the Weibull statistics of ceramic strength, is the size effect. In this study, we analyze the size effect on ceramic strength using the finite element analysis (FEA) methodology previously proposed by the authors. In the FEA methodology, the data of the microstructure distribution (i.e., relative density, size, and aspect ratio of the pore and the grain size) are considered as input parameters of a continuum damage model via a fracture mechanical model. Specifically, we examine five sizes of rectangular specimens under three types of loading conditions. Then, we simulate the fracture stresses of sets of 30 specimens under each size and loading condition and obtain the relationship between the scale parameter and effective volume using the Weibull distribution. The results suggest that the proposed FEA methodology can be applied to the analysis of the fracture probability of ceramics, including the size effect.

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