Design and development of lead-free glass-metallic vacuum materials for the construction and thermal performance of smart fusion edge-sealed vacuum glazing

Glass frit is a major component of thick film resistor (TFR) for the production of hybrid circuits. More than thirty commercial lead-free glass frits with different compositions have been evaluated for developing a lead-free thick film resistor that is compatible with typical industry thick film processing and has comparable electrical properties as the lead bearing counterpart. Two glass compositions were selected out of 33 candidates for preparation of RuO2 based TFR inks, which were screen printed on alumina substrates and fired at 850°C. The preliminary results of these resistors showed that the sheet resistance spanned from 400 ohms per square (Ω/□) to 0.4 mega-ohms per square (MΩ/□) with 5–15% RuO2 and the hot temperature coefficient of resistance (HTCR) fell in a range of ±350ppm/°C.

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Thermal Conductivity Measurement of Vacuum Tight Dual- Edge Seal for the Thermal Performance Analysis of Triple Vacuum Glazing

Impact of Thermal Conductivity on Energy Technologies ◽

10.5772/intechopen.74255 ◽

2018 ◽

Author(s):

Saim Memon

Keyword(s):

Thermal Conductivity ◽

Performance Analysis ◽

Thermal Performance ◽

Conductivity Measurement ◽

Thermal Conductivity Measurement ◽

Vacuum Glazing

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Properties of SnO-B2O3-SiO2 Lead-Free Glass Powder

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.412.133 ◽

2011 ◽

Vol 412 ◽

pp. 133-137 ◽

Cited By ~ 2

Author(s):

Hua Zhu ◽

Guo You Gan ◽

Ji Kang Yan ◽

Jin Hong Du ◽

Jian Hong Yi ◽

...

Keyword(s):

Thermal Analysis ◽

Heavy Metal ◽

Differential Thermal Analysis ◽

Glass Transition ◽

Glass Powder ◽

Lead Free ◽

Prepared Glass ◽

Excellent Chemical ◽

Temperature Melting ◽

Free Glass

SnO-B2O3-SiO2 glass powders, in which the different contents of SnO and B2O3 were 35% ~ 70%wt and 26% ~ 61% wt respectively, were prepared through high-temperature melting, water quenching and Ball milling. XRD showed that the performance of forming glass was very good and the range of extension was very wide. The effect of the contents of SnO and B2O3 on Tg, acidoresistant and density of prepared glass was studied. IR showed that it generates the heavy metal oxide generated glass. The density of glass powder decrease with increase of B2O3 content, but increase with increasing SnO content. SnO-B2O3-SiO2 glass had excellent chemical stability. Differential thermal analysis (DTA) shown that, with increasing SnO content, glass transition temperature first lower and then decreased.

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New interdigital design for large area dye solar modules using a lead-free glass frit sealing

Progress in Photovoltaics Research and Applications ◽

10.1002/pip.700 ◽

2006 ◽

Vol 14 (8) ◽

pp. 697-709 ◽

Cited By ~ 56

Author(s):

R. Sastrawan ◽

J. Beier ◽

U. Belledin ◽

S. Hemming ◽

A. Hinsch ◽

...

Keyword(s):

Glass Frit ◽

Lead Free ◽

Large Area ◽

Free Glass

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Evaluation of Thermal Performance for Vacuum Glazing by Using Three-Dimensional Finite Element Model

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.492.328 ◽

2011 ◽

Vol 492 ◽

pp. 328-332 ◽

Cited By ~ 6

Author(s):

Zhi Ming Han ◽

Yi Wang Bao ◽

Wei Dong Wu ◽

Zheng Quan Liu ◽

Xiao Gen Liu ◽

...

Keyword(s):

Heat Transfer ◽

Thermal Performance ◽

Simulation Analysis ◽

Three Dimensional ◽

Central Area ◽

Element Model ◽

Transfer Coefficients ◽

Heat Transfer Coefficients ◽

Vacuum Glazing ◽

Three Dimensional Finite Element

Simulation analysis of thermal performance for vacuum glazing was conducted in this paper. The heat conduction through the support pillars and edge seal and the radiation between two glass sheets were considered. The heat conductance of residual gas in vacuum gap was ignored for a low pressure of less than 0.1Pa. Two pieces of vacuum glazing with sizes of 0.3 × 0.3 m and 1.0 × 1.0 m were simulated. In order to check the accuracy of simulations with specified mesh number, the thermal performance of a small central area (4mm×4mm) with a single pillar in the center was simulated using a graded mesh of 41×41×5 nodes. The heat transfer coefficients of this unit obtained from simulation and analytic prediction were 2.194Wm-2K-1and 2.257Wm-2K-1respectively, with a deviation of 2.79%. The three dimensional (3D) isotherms and two dimensional (2D) isotherms on the cold and hot surfaces of the specimens were also presented. For a validity of simulated results, a guarded hot box calorimeter was used to determine the experimental thermal performance of 1.0m×1.0m vacuum glazing. The overall heat transfer coefficients obtained from experiment and simulation were 2.55Wm-2K-1 and 2.47Wm-2K-1respectively, with a deviation of 3.14%.

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High Reliability and Thermal Performance FCBGA Package

Volume 5: Electronics and Photonics ◽

10.1115/imece2007-41794 ◽

2007 ◽

Author(s):

Gino Hung ◽

Ho-Yi Tsai ◽

Chun An Huang ◽

Steve Chiu ◽

C. S. Hsiao

Keyword(s):

Thermal Performance ◽

High Performance ◽

Flip Chip ◽

Dielectric Material ◽

High Reliability ◽

Lead Free ◽

Molding Process ◽

Molding Compound ◽

Reliability Performance ◽

Low K

A high reliability and high thermal performance molding flip chip ball grid arrays structure which was improved from Terminator FCBGA®. (The structure are shown as Fig. 1) It has many advantages, like better coplanarity, high through put (multi pes for each shut of molding process), low stress, and high thermal performance. In conventional flip chip structure, underfill dispenses and cure processes are a bottleneck due to low through put (dispensing unit by unit). For the high performance demand, large package/die size with more integrated functions needs to meet reliability criteria. Low k dielectric material, lead free bump especially and the package coplanarity are also challenges for package development. Besides, thermal performance is also a key concern with high power device. From simulation and reliability data, this new structure can provide strong bump protection and reach high reliability performance and can be applied for low-K chip and all kind of bump composition such as tin-lead, high lead, and lead free. Comparing to original Terminator FCBGA®, this structure has better thermal performance because the thermal adhesive was added between die and heat spreader instead of epoxy molding compound (EMC). The thermal adhesive has much better thermal conductivity than EMC. Furthermore, this paper also describes the process and reliability validation result.

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