Investigation of a nanofluid-cooled microchannel heat sink using Fin and porous media approaches

2009 ◽  
Vol 50 (9) ◽  
pp. 2373-2380 ◽  
Author(s):  
Mohammad Ghazvini ◽  
Hossein Shokouhmand
Author(s):  
Jinyuan Wang ◽  
Yi-Peng Xu ◽  
Raed Qahiti ◽  
M. Jafaryar ◽  
Mashhour A. Alazwari ◽  
...  

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jyoti Pandey ◽  
Mohd. Zahid Ansari ◽  
Afzal Husain

Purpose Porous media can provide excellent performance in thermal energy transport applications. This study aims to optimise the square porous slabs (placed in the middle of the channel) parameters to enhance the cooling performance of the jet-impingement microchannel heat sink. Design/methodology/approach Three levels of each design parameters, i.e. porous slab side, porous slab height, type of material, permeability and quadratic drag factor, are studied; and an L27 orthogonal array is adopted to generate the design points in the specified design space. Optimum designs of the porous media slabs are achieved to minimise the maximum-wall temperature, thermal resistance and pressure drop and maximise the average heat transfer coefficient and figure of merit (FOM). Findings Results exhibited that the porous media material and permeability are the most, whereas drag factor is the least significant factors with respect to the overall performance of the heat sink. The optimum value of FOM for the proposed hybrid heat sink model belongs to the set of design variables, i.e. 0.4 mm slab side, 0.6 mm slab height, 5 × 10−11 m2 permeability, 0.21 drag factor and copper as substrate material. Originality/value This study proposes a novel design and a hybrid approach to investigate and optimise the hydrothermal performance of jet impingements on porous slabs inserted in the microchannels.


2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.


Sign in / Sign up

Export Citation Format

Share Document