Optimisation of porous slab parameters for jet-impingement microchannel heat sink performance enhancement

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jyoti Pandey ◽  
Mohd. Zahid Ansari ◽  
Afzal Husain
Keyword(s):  
Porous Media ◽  
Heat Sink ◽  
Performance Enhancement ◽  
Hybrid Approach ◽  
Jet Impingement ◽  
Design Parameters ◽  
Microchannel Heat Sink ◽  
Content Type ◽  
Quadratic Drag ◽  
Drag Factor

Purpose Porous media can provide excellent performance in thermal energy transport applications. This study aims to optimise the square porous slabs (placed in the middle of the channel) parameters to enhance the cooling performance of the jet-impingement microchannel heat sink. Design/methodology/approach Three levels of each design parameters, i.e. porous slab side, porous slab height, type of material, permeability and quadratic drag factor, are studied; and an L27 orthogonal array is adopted to generate the design points in the specified design space. Optimum designs of the porous media slabs are achieved to minimise the maximum-wall temperature, thermal resistance and pressure drop and maximise the average heat transfer coefficient and figure of merit (FOM). Findings Results exhibited that the porous media material and permeability are the most, whereas drag factor is the least significant factors with respect to the overall performance of the heat sink. The optimum value of FOM for the proposed hybrid heat sink model belongs to the set of design variables, i.e. 0.4 mm slab side, 0.6 mm slab height, 5 × 10−11 m2 permeability, 0.21 drag factor and copper as substrate material. Originality/value This study proposes a novel design and a hybrid approach to investigate and optimise the hydrothermal performance of jet impingements on porous slabs inserted in the microchannels.

Simulation of hybrid nanofluid flow within a microchannel heat sink considering porous media analyzing CPU stability

2021 ◽  
pp. 109734
Author(s):  
Jinyuan Wang ◽  
Yi-Peng Xu ◽  
Raed Qahiti ◽  
M. Jafaryar ◽  
Mashhour A. Alazwari ◽  
...  
Keyword(s):  
Porous Media ◽  
Heat Sink ◽  
Hybrid Nanofluid ◽  
Microchannel Heat Sink ◽  
Nanofluid Flow

Experimental Investigation on Convective Heat Transfer Enhancement of Laminar Slot Jet Impingement in the Presence of Porous Medium

2016 ◽  
Author(s):  
Sampath Kumar Chinige ◽  
Arvind Pattamatta
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Porous Medium ◽  
Porous Media ◽  
Nusselt Number ◽  
Heat Sink ◽  
Average Nusselt Number ◽  
Jet Impingement ◽  
Transfer Enhancement ◽  
Porous Obstacle

An experimental study using Liquid crystal thermography technique is conducted to study the convective heat transfer enhancement in jet impingement cooling in the presence of porous media. Aluminium porous sample of 10 PPI with permeability 2.48e−7 and porosity 0.95 is used in the present study. Results are presented for two different Reynolds number 400 and 700 with four different configurations of jet impingement (1) without porous foams (2) over porous heat sink (3) with porous obstacle case (4) through porous passage. Jet impingement with porous heat sink showed a deterioration in average Nusselt number by 10.5% and 18.1% for Reynolds number of 400 and 700 respectively when compared with jet impingement without porous heat sink configuration. The results show that for Reynolds number 400, jet impingement through porous passage augments average Nusselt number by 30.73% whereas obstacle configuration enhances the heat transfer by 25.6% over jet impingement without porous medium. Similarly for Reynolds number 700, the porous passage configuration shows average Nusselt number enhancement by 71.09% and porous obstacle by 33.4 % over jet impingement in the absence of porous media respectively.

Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink

2013 ◽  
Author(s):  
Afzal Husain ◽  
Jun-Hee Kim ◽  
Kwang-Yong Kim
Keyword(s):  
Laminar Flow ◽  
Thermal Performance ◽  
Heat Sink ◽  
Jet Impingement ◽  
Low Flow ◽  
Design Parameters ◽  
Computational Domain ◽  
Flow Conditions ◽  
Silicon Based ◽  
Laminar Flow Conditions

The present study investigates thermal performance of a silicon-based multiple micro-jet impingement heat sink for thermal management of electronics. Three-dimensional numerical analysis was performed for steady incompressible laminar flow and conjugate heat transfer through a finite volume solver. A moderate heat flux, 100 W/cm2, is applied at the one end of the silicon substrate, while at the other end jet impingement system is designed. The jet plate is consisted of many jet holes whereas computational domain was simplified by utilizing symmetric boundary conditions across a lateral pitch as well as a central plane in x-direction. The effect of design parameters, namely, jet diameter and jet pitch has been analyzed at constant jet Reynolds numbers under laminar flow conditions on the performance of the heat sink. In view of the low pumping powers available from the micro-pumping devices, low flow rates are applied for the analysis. The cross-flow effects of the spent-flow are investigated for finding out optimum design parameters of the heat sink. The temperature distribution is discussed for number of jets, jet diameter and jet-to-jet spacing across the flow direction. While a moderate thermal resistance of the heat sink was obtained under laminar flow conditions, high performance can be achieved for turbulent flow conditions at the expense of excessive pressure drop which would be investigated in future studies.

Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations

Energies ◽  
2020 ◽  
Vol 13 (21) ◽  
pp. 5616
Author(s):  
Safi Ahmed Memon ◽  
Taqi Ahmad Cheema ◽  
Gyu Man Kim ◽  
Cheol Woo Park
Keyword(s):  
Secondary Flow ◽  
Heat Sink ◽  
Performance Enhancement ◽  
Volumetric Flow Rate ◽  
Base Plate ◽  
Secondary Flows ◽  
Heat Sinks ◽  
Microchannel Heat Sink ◽  
Rectangular Microchannel ◽  
Flow Channels

Thermal performance enhancement in microchannel heat sinks has recently become a challenge due to advancements in modern microelectronics, which demand compatibility with heat sinks able to dissipate ever-increasing amounts of heat. Recent advancements in manufacturing techniques, such as additive manufacturing, have made the modification of the microchannel heat sink geometry possible well beyond the conventional rectangular model to improve the cooling capacity of these devices. One such modification in microchannel geometry includes the introduction of secondary flow channels in the walls between adjacent mainstream microchannels. The present study computationally models secondary flow channels in regular trapezoidal and parallel orientations for fluid circulation through the microchannel walls in a heat sink design. The heat sink is made of silicon wafer, and water is used as the circulating fluid in this study. Continuity, momentum, and energy equations are solved for the fluid flow through the regular trapezoidal secondary flow and parallel secondary flow designs in the heat sink with I-type, C-type, and Z-type inlet–outlet configurations. Plots of velocity contours show that I-type geometry creates optimal flow disruption in the heat sink. Therefore, for this design, the pressure drop and base plate temperatures are plotted for a volumetric flow rate range, and corresponding contour plots are obtained. The results are compared with corresponding trends for the conventional rectangular microchannel design, and associated trends are explained. The study suggests that the flow phenomena such as flow impingement onto the microchannel walls and formation of vortices inside the secondary flow passages coupled with an increase in heat transfer area due to secondary flow passages may significantly improve the heat sink performance.

Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

2010 ◽  
Vol 132 (8) ◽  
Author(s):  
W. Escher ◽  
T. Brunschwiler ◽  
B. Michel ◽  
D. Poulikakos
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Flow Rate ◽  
Heat Sink ◽  
Volumetric Flow Rate ◽  
Maximum Temperature ◽  
Design Parameters ◽  
Cooling Power ◽  
Microchannel Heat Sink ◽  
Manifold Microchannel

We report an experimental investigation of a novel, high performance ultrathin manifold microchannel heat sink. The heat sink consists of impinging liquid slot-jets on a structured surface fed with liquid coolant by an overlying two-dimensional manifold. We developed a fabrication and packaging procedure to manufacture prototypes by means of standard microprocessing. A closed fluid loop for precise hydrodynamic and thermal characterization of six different test vehicles was built. We studied the influence of the number of manifold systems, the width of the heat transfer microchannels, the volumetric flow rate, and the pumping power on the hydrodynamic and thermal performance of the heat sink. A design with 12.5 manifold systems and 25 μm wide microchannels as the heat transfer structure provided the optimum choice of design parameters. For a volumetric flow rate of 1.3 l/min we demonstrated a total thermal resistance between the maximum heater temperature and fluid inlet temperature of 0.09 cm2 K/W with a pressure drop of 0.22 bar on a 2×2 cm2 chip. This allows for cooling power densities of more than 700 W/cm2 for a maximum temperature difference between the chip and the fluid inlet of 65 K. The total height of the heat sink did not exceed 2 mm, and includes a 500 μm thick thermal test chip structured by 300 μm deep microchannels for heat transfer. Furthermore, we discuss the influence of elevated fluid inlet temperatures, allowing possible reuse of the thermal energy, and demonstrate an enhancement of the heat sink cooling efficiency of more than 40% for a temperature rise of 50 K.

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