Probabilistic life assessment on fatigue crack growth in mixed-mode by coupling of Kriging model and finite element analysis

2015 ◽  
Vol 139 ◽  
pp. 56-77 ◽  
Author(s):  
Wentao He ◽  
Jingxi Liu ◽  
De Xie
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Mixed Mode ◽  
Kriging Model ◽  
Life Assessment ◽  
Element Analysis

scholarly journals Estimation of Fatigue Crack Growth Rate for 7% Nickel Steel under Room and Cryogenic Temperatures Using Damage-Coupled Finite Element Analysis

Metals ◽  
2015 ◽  
Vol 5 (2) ◽  
pp. 603-627 ◽  
Author(s):  
Seul-Kee Kim ◽  
Chi-Seung Lee ◽  
Jeong-Hyeon Kim ◽  
Myung-Hyun Kim ◽  
Byeong-Jae Noh ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Growth Rate ◽  
Finite Element ◽  
Fatigue Crack ◽  
Crack Growth Rate ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Nickel Steel ◽  
Cryogenic Temperatures ◽  
Element Analysis

An Experimental Technique for Studying Mixed-Mode Fatigue Crack Growth in Solder Joints

1996 ◽  
Vol 118 (2) ◽  
pp. 45-48 ◽  
Author(s):  
Daping Yao ◽  
Z. Zhang ◽  
J. K. Shang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Crack ◽  
Crack Growth ◽  
Mixed Mode ◽  
Solder Joints ◽  
Fatigue Loading ◽  
Mixed Mode Loading ◽  
Element Analysis ◽  
Solder Layer

Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu substrate. The technique was based on a tri-layer solder/Cu joints, with the solder layer sand-wiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the mixed-mode condition at the crack tip as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.

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