3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heat sink with liquid flow

Computational fluid analysis study has been carried out to find a better prospect of perfect design, shape and plenum size microchannel heat sink (MCHS). Distinctive structure parameters were chosen to plan microchannel heat sink with shifting channel planum sizes of 10 mm, 20 mm and 30 mm. The material taken of circle type heat sink is taken as copper. The liquid taken is plane fluid. Amid liquid stream distinctive speed stream states of significant worth 0.25 lpm, 0.50 lpm and 0.75 lpm were chosen. In computational liquid examination changing weight, temperature and speed conditions impacts were additionally contemplated. Huge weight drop is recorded in the speed rating of 0.25 lpm. Speed readings were recorded high en 30 mm plenum estimate with 0.75 lpm speed stream. Investigation gives thought of an ideal structure fit as a fiddle with stream of liquid at 0.75 speed stream. The stream space were understood utilizing ANSYS programming as economically accessible for CFD examination. A special plan is set up from the examination which can exchange extensive measure of warmth in the state of microchannel heat sinks with microchannel length of 48 mm long and with other chose structure paramters. To accomplish more warmth expulsion from the MCHS the microchannel estimate upgrade is done diagnostically. For ordinary convective warmth trade coefficient, outlet temperature, grinding and weight drop, siphoning power and warm impediment have been plotted against Nusselt number qualities for various stream conditions. By settling the correct control of the liquid stream and warmth exchange propensity of a 3- dimensional MCHS has been accomplished computationally.

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Numerical optimization of microchannel heat sink (MCHS) performance cooled by KKL based nanofluids in saturated porous medium

Journal of the Taiwan Institute of Chemical Engineers ◽

10.1016/j.jtice.2015.04.016 ◽

2015 ◽

Vol 55 ◽

pp. 49-68 ◽

Cited By ~ 91

Author(s):

O. Pourmehran ◽

M. Rahimi-Gorji ◽

M. Hatami ◽

S.A.R. Sahebi ◽

G. Domairry

Keyword(s):

Porous Medium ◽

Heat Sink ◽

Numerical Optimization ◽

Saturated Porous Medium ◽

Microchannel Heat Sink

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Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks

2010 14th International Heat Transfer Conference, Volume 6 ◽

10.1115/ihtc14-23413 ◽

2010 ◽

Cited By ~ 2

Author(s):

Yong-Jiun Lee ◽

Poh-Seng Lee ◽

Siaw-Kiang Chou

Keyword(s):

Heat Transfer ◽

Experimental Investigation ◽

Heat Sink ◽

Leading Edge ◽

Secondary Flows ◽

Heat Sinks ◽

Fluid Mixing ◽

Working Fluid ◽

Microchannel Heat Sink ◽

Silicon Based

Sectional oblique fins are employed in contrast to the continuous fins in order to modulate the flow in microchannel heat sink. Experimental investigation of silicon based oblique finned microchannel heat sink demonstrated a highly augmented and uniform heat transfer performance against the conventional microchannel. The breakage of continuous fin into oblique sections leads to the re-initialization of the thermal boundary layers at the leading edge of each oblique fin, effectively reducing the boundary-layer thickness. This regeneration of the entrance effect causes the flow to be always in a developing state thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a fraction of the flow into the adjacent main channels. The secondary flows thus created improve fluid mixing which serves to further enhance the heat transfer. The average Nusselt number, Nuave, for the silicon microchannel heat sink which uses water as the working fluid can increase as much as 55%, from 8.8 to 13.6. Besides, the augmented convective heat transfer leads to reduction in both maximum chip temperature and its temperature gradient, by 8.6°C and 47% respectively. Interestingly, there is only little or negligible pressure drop penalty associated with this novel heat transfer enhancement scheme in contrast to conventional enhancement techniques.

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Critical Heat Flux of R-123 in Silicon-Based Microchannels

Journal of Heat Transfer ◽

10.1115/1.2712852 ◽

2006 ◽

Vol 129 (7) ◽

pp. 844-851 ◽

Cited By ~ 47

Author(s):

Ali Koşar ◽

Yoav Peles

Keyword(s):

Heat Flux ◽

Critical Heat Flux ◽

Heat Sink ◽

Mass Velocity ◽

Heat Fluxes ◽

Microchannel Heat Sink ◽

New Correlation ◽

Mass Fluxes ◽

System Pressure ◽

Silicon Based

Critical heat flux (CHF) of R-123 in a silicon-based microchannel heat sink was investigated at exit pressures ranging from 227kPato520kPa. Critical heat flux data were obtained over effective heat fluxes ranging from 53W∕cm2to196W∕cm2 and mass fluxes from 291kg∕m2sto1118kg∕m2s. Flow images and high exit qualities suggest that dryout is the leading CHF mechanism. The effect of mass velocity, exit quality, and system pressure were also examined, and a new correlation is presented to represent the effect of these parameters.

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