Effect of constraint and latent hardening ratio on the plastic flow around a crack tip in a hardening FCC single crystal

2019 ◽  
Vol 115 ◽  
pp. 132-153 ◽  
Author(s):  
Nipal Deka ◽  
Krishna N. Jonnalagadda
Keyword(s):  
Single Crystal ◽  
Plastic Flow ◽  
Crack Tip ◽  
Latent Hardening

Prediction of the Initial Crack Tip Microstructure in a Single Crystal of CuAlNi

1999 ◽  
Author(s):  
Galyna M. Vasko ◽  
Perry H. Leo ◽  
Thomas W. Shield
Keyword(s):  
Stress Field ◽  
Single Crystal ◽  
Crack Opening ◽  
Crack Tip ◽  
Initial Crack ◽  
Single Edge ◽  
Opening Displacement ◽  
Elastic Crack ◽  
Maximum Work ◽  
Anisotropic Elastic

Abstract The austenite to martensite pseudoelastic transformation induced by the anisotropic elastic crack tip stress field in a single crystal of shape memory alloy is considered. It is proposed that the orientation of the initial austenite-martensite interface that forms can be predicted based on knowledge of the stress field, the crystallography of the transformation and one of two selection criteria. These criteria are based on the work of formation of the martensite in stress field and the crack opening displacement the martensite causes at the crack. Predictions of the criteria are compared to experiments on three single edge notched CuAlNi single crystal specimens. Results indicate that the maximum work criterion accurately predicts the orientation of the austenite-martensite interfaces that initially form near a crack.

Crack tip plasticity in single crystal UO2: Atomistic simulations

2012 ◽  
Vol 430 (1-3) ◽  
pp. 96-105 ◽  
Author(s):  
Yongfeng Zhang ◽  
Xiang-Yang Liu ◽  
Paul C. Millett ◽  
Michael Tonks ◽  
David A. Andersson ◽  
...  
Keyword(s):  
Single Crystal ◽  
Crack Tip ◽  
Atomistic Simulations ◽  
Crack Tip Plasticity

Simulation of near-Crack-Tip Strain Fields on Single-Crystal Silicon Wafer

2012 ◽  
Vol 430-432 ◽  
pp. 404-407
Author(s):  
J.J. Li ◽  
C.W. Zhao ◽  
Y.M. Xing ◽  
Z.Y. Lv ◽  
Y.G. Du
Keyword(s):  
Single Crystal ◽  
Silicon Wafer ◽  
Single Crystal Silicon ◽  
Crack Tip ◽  
Tensile Load ◽  
Crystal Silicon ◽  
Strain Fields ◽  
Single Crystal Silicon Wafer ◽  
Linear Elastic ◽  
Technological Developments

The failure components made of silicon is an important issue in the electronic and nano-technological developments. A study on the near-crack-tip deformation of single-crystal silicon wafer under tensile load was presented. The strain formulas around the crack tip of mode I crack were deduced from linear elastic fracture mechanics. The strain fields around the crack tip were simulated and analyzed in detail.

Atomistic Simulation of Deformation Behavior at a Crack Tip in Magnesium Single Crystal

2011 ◽  
Vol 675-677 ◽  
pp. 949-951
Author(s):  
Li Ming Jiang ◽  
Ya Fang Guo
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Deformation Behavior ◽  
Atomistic Simulation ◽  
Shear Banding ◽  
Crack Tip ◽  
Temperature Deformation ◽  
Dynamics Simulations ◽  
Main Deformation ◽  
Model Crack

The mechanisms of low-temperature deformation around a crack tip in a hexagonally closed-packed (hcp) magnesium single crystal have been studied by molecular dynamics simulations. In our simulation a {1010} < 12 10 > model I (opening model) crack is selected. The results indicate that slip on the basal plane is activated due to the shear stress at the crack tip. Thus shear banding caused by a successive slip of the basal planes is the main deformation way for this type of crack.

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