Influencing on liquid quenching by surface structuring

2016 ◽  
Vol 101 ◽  
pp. 133-142 ◽  
Author(s):  
Nikolay Kozlov ◽  
Olaf Keßler
1994 ◽  
Vol 181-182 ◽  
pp. 888-891 ◽  
Author(s):  
Noriyuki Kataoka ◽  
Ick Jun Kim ◽  
Hideki Takeda ◽  
Kazuaki Fukamichi ◽  
Yutaka Shimada

2010 ◽  
Vol 24 (13-14) ◽  
pp. 2257-2270 ◽  
Author(s):  
E. Fadeeva ◽  
S. Schlie ◽  
J. Koch ◽  
B. N. Chichkov

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 567
Author(s):  
Xin Zou ◽  
Lifu Huang ◽  
Ke Chen ◽  
Muyang Jiang ◽  
Shanyong Zhang ◽  
...  

In order to enhance the joint performance of Ti6Al4V titanium alloy (TC4) and ultra-high molecular weight polyethylene (UHMWPE) for biomedical applications, different structures were fabricated on TC4 surfaces via electron beam melting (EBM) method in this study. Macromorphologies and microinterfaces of TC4–UHMWPE joints produced via hot pressing technique were carefully characterized and analyzed. The effects of different surface structures on mechanical properties and fractured surfaces were investigated and compared. Strong direct bonding (1751 N) between UHMWPE and TC4 was achieved. The interfacial bonding behavior of TC4–UHMWPE joints was further discussed. This study demonstrates the importance of combining macro- and micromechanical interlocking, which is a promising strategy for improving metal–polymer joint performance. It also provides guidance for metal surface structuring from both theoretical and practical perspectives.


2021 ◽  
Author(s):  
◽  
Mindaugas Kamarauskas

Intentional modification of silicon photovoltaic devices by deep surface structuring and two dimensional material coatings


1996 ◽  
Vol 03 (01) ◽  
pp. 897-900 ◽  
Author(s):  
JÜRGEN GSPANN

Beams of ionized clusters of some thousand atoms are accelerated to about 100-keV kinetic energy to be used for area selective surface erosion. Mask projective cluster-impact lithography allows surface structuring in the submicron regime. Chemical reactions between the cluster and the target material may provide volatile reaction products facilitating ejecta removal. The reactive accelerated cluster erosion (RACE) process is applied to metals like copper and gold, to semiconductors such as silicon, and to insulators like glass, quartz, or sapphire, giving very smooth eroded surface and steep sidewalls.


2004 ◽  
Vol 4 (2-4) ◽  
pp. 241-244 ◽  
Author(s):  
A Markwitz ◽  
V.J Kennedy ◽  
K Short ◽  
M Rudolphi ◽  
H Baumann

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