In-situ EIS study on the initial corrosion evolution behavior of SAC305 solder alloy covered with NaCl solution

The electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder alloy under thin electrolyte layers was investigated using a technique based on the coupling of in situ electrochemical measurements and optical observation. Results showed that the mean time to failure first increased and then decreased as thickness of the electrolyte layer increased, the maximum value was present at 200[Formula: see text][Formula: see text]m. The higher the bias voltage applied, the faster was the rate of dendrite growth. And, Sn leaded the ECM of SAC305 solder alloy. Mechanisms relevant have been proposed to explain the ECM behavior of Sn-3.0Ag-0.5Cu solder alloy.

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Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

10.21203/rs.3.rs-36424/v1 ◽

2020 ◽

Author(s):

Manoj Kumar Pal ◽

Gréta Gergely ◽

Dániel Koncz-Horváth ◽

Zoltán Gácsi

Keyword(s):

Silicon Carbide ◽

Intermetallic Compounds ◽

Solder Alloy ◽

Solder Matrix ◽

Microstructure Analysis ◽

Lead Free ◽

Lead Free Solder ◽

Sac305 Solder ◽

Small Change ◽

Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

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Pitting behaviors of low-alloy high strength steel in neutral 3.5 wt% NaCl solution based on in situ observations

Journal of Electroanalytical Chemistry ◽

10.1016/j.jelechem.2020.114056 ◽

2020 ◽

Vol 863 ◽

pp. 114056

Author(s):

Hongyi Su ◽

Shicheng Wei ◽

Yi Liang ◽

Yujiang Wang ◽

Bo Wang ◽

...

Keyword(s):

High Strength Steel ◽

High Strength ◽

Nacl Solution ◽

In Situ Observations

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Evolution of the Corrosion Product Film on Nickel-Aluminum Bronze and Its Corrosion Behavior in 3.5 wt % NaCl Solution

Materials ◽

10.3390/ma12020209 ◽

2019 ◽

Vol 12 (2) ◽

pp. 209 ◽

Cited By ~ 6

Author(s):

Yang Ding ◽

Rong Zhao ◽

Zhenbo Qin ◽

Zhong Wu ◽

Liqiang Wang ◽

...

Keyword(s):

Corrosion Product ◽

Aluminum Bronze ◽

Protective Film ◽

Nickel Aluminum ◽

Nacl Solution ◽

Corrosion Attack ◽

Corrosion Product Film ◽

Product Film ◽

Nickel Aluminum Bronze

The in-situ studies of the corrosion product film on nickel-aluminum bronze are significant for explaining the mechanism of its corrosion resistance. In this paper, the corrosion behavior of nickel-aluminum bronze and the formation process of the protective film in 3.5 wt % NaCl solution are systematically investigated. The results of scanning electron microscope analysis and electrochemical tests indicate that the corrosion resistance of nickel-aluminum bronze is improved due to the formation of the corrosion product film. The change of local electrochemical property on the corrosion product film during the immersion time is evaluated via in-situ scanning vibrating electrode technique, and it reveals the evolution rules of ionic flux in real time. The formation process of the protective film on different phases in nickel-aluminum bronze is observed directly by in-situ atomic force microscopy as height change measurements. The α phases at different locations present different corrosion behaviors, and the lamellar α phase within the α + κIII eutectoid structure gets more serious corrosion attack. The κ phases establish a stable and dense protective film in short time, preventing the corrosion attack effectively. The β′ phase, however, suffers the most serious corrosion damage until a protective film is formed after 150 min of immersion.

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In situ growth and protectiveness mechanism of layered double hydroxide/oxide hierarchical structure on copper alloy in 3.5 wt% NaCl solution

Surface and Coatings Technology ◽

10.1016/j.surfcoat.2020.126042 ◽

2020 ◽

Vol 397 ◽

pp. 126042

Author(s):

Ying Jiang ◽

Guoteng Zhang ◽

Juanjuan Xing ◽

Hongqiang Fan ◽

Liang Wei ◽

...

Keyword(s):

Layered Double Hydroxide ◽

Hierarchical Structure ◽

Copper Alloy ◽

In Situ Growth ◽

Nacl Solution ◽

Double Hydroxide

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Study of the Microstructure and Crack Evolution Behavior of Al-5Fe-1.5Er Alloy

Materials ◽

10.3390/ma12010172 ◽

2019 ◽

Vol 12 (1) ◽

pp. 172 ◽

Cited By ~ 2

Author(s):

Ming Li ◽

Zhiming Shi ◽

Xiufeng Wu ◽

Huhe Wang ◽

Yubao Liu

Keyword(s):

Electron Microscopy ◽

Crack Initiation ◽

Tensile Tests ◽

Eutectic Structure ◽

Interface Structure ◽

X Ray ◽

Transmission Electron ◽

The Matrix ◽

Evolution Behavior

In this work, the microstructure of Al-5Fe-1.5Er alloy was characterized and analyzed using X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and energy-dispersive X-ray spectroscopy (EDS) techniques. The effect of microstructure on the behavior of crack initiation and propagation was investigated using in situ tensile testing. The results showed that when 1.5 wt.% Er was added in the Al-5Fe alloy, the microstructure consisted of α-Al matrix, Al3Fe, Al4Er, and Al3Fe + Al4Er eutectic phases. The twin structure of Al3Fe phase was observed, and the twin plane was {001}. Moreover, a continuous concave and convex interface structure of Al4Er was observed. Furthermore, Al3Fe was in the form of a sheet with a clear gap inside. In situ tensile tests of the alloy at room temperature showed that the crack initiation mainly occurred in the Al3Fe phase, and that the crack propagation modes included intergranular and trans-granular expansions. The crack trans-granular expansion was due to the strong binding between Al4Er phases and surrounding organization, whereas the continuous concave and convex interface structure of Al4Er provided a significant meshing effect on the matrix and the eutectic structure.

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