Dissolution of brominated epoxy resin for environment friendly recovery of copper as cupric oxide nanoparticles from waste printed circuit boards using ammonium chloride roasting

2021 ◽  
Vol 291 ◽  
pp. 125928
Author(s):  
Ramdayal Panda ◽  
Kamal Kishore Pant ◽  
Thallada Bhaskar ◽  
Satya Narayan Naik
Keyword(s):  
Epoxy Resin ◽  
Printed Circuit Boards ◽  
Cupric Oxide ◽  
Oxide Nanoparticles ◽  
Circuit Boards ◽  
Environment Friendly ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Brominated Epoxy Resin ◽  
Cupric Oxide Nanoparticles

Investigation on Dissolution of Brominated Epoxy Resin Using Ionic Liquid [Bmim]Cl from Waste Printed Circuit Boards

2015 ◽  
Vol 768 ◽  
pp. 588-594 ◽  
Author(s):  
Min Xu ◽  
Jing Wei Wang ◽  
Yu Xing Mao ◽  
Hong Yong Xie
Keyword(s):  
Ionic Liquid ◽  
Epoxy Resin ◽  
Printed Circuit Boards ◽  
Dissolution Mechanism ◽  
Circuit Boards ◽  
Liquid Ratio ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Brominated Epoxy Resin ◽  
Solid Liquid

Treatment technology of brominated epoxy resin (BER) is still a big challenge to waste printed circuit boards (PCBs) recycling. In order to make full use of the materials, ionic liquid 1-butyl-3-methyl imidazole chloride ([Bmim]Cl) was used to dissolve BER to separate glass fibers from PCB nonmetallic powders. The effects of dissolving parameters including temperature, time and solid/ liquid ratio on the dissolution rate of BER were investigated. The dissolved BER were regenerated and were characterized by FTIR and thermal analysis. Results showed that [Bmim]Cl was a good direct solvent for BER dissolution and at a suitable condition of 170°Cfor 6 hours with solid/liquid ratio of 1: 20 (g/g), nearly 90% of BER in original powders were dissolved. The possible dissolution mechanism was also discussed.

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