Liberation of metal clads of waste printed circuit boards by removal of halogenated epoxy resin substrate using dimethylacetamide

2017 ◽  
Vol 60 ◽  
pp. 652-659 ◽  
Author(s):  
Himanshu Ranjan Verma ◽  
Kamalesh K. Singh ◽  
Tilak Raj Mankhand
2011 ◽  
Vol 383-390 ◽  
pp. 3140-3144 ◽  
Author(s):  
Lin Zhuan Ma ◽  
Hua Wang ◽  
Shan Qing ◽  
Lin Zhuan Ma

Currently, the number of the waste printed circuit boards (WPCB) is increasing. The technologies of extracting and reclaiming of the value of the metallic fraction of WPCB have been used widely because of the major economic driving force. But the non-metallic fractions (NMFs), which take up almost 70wt% of waste WPCB, were mainly treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenxofurans (PBDD/Fs). Land filling of the NMFs will lead to secondly pollution that caused by heavy meatals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. How to recycle the NMFs environmental soundly has become a significant topic in recycling of WPCB. This paper briefly introduced that the damage of WPCB and the recycling methods of epoxy resin. The method was established for recycling of WPCB by using solvent extraction. And the optimal conditions were attained through experiments: the reaction temperature was 80°C、the reaction time was 3h、the concentration of nitrate acid was 8 mol/l, the amount of nitrate acid : the quality of WPCB was 50ml/10g.


2015 ◽  
Vol 768 ◽  
pp. 588-594 ◽  
Author(s):  
Min Xu ◽  
Jing Wei Wang ◽  
Yu Xing Mao ◽  
Hong Yong Xie

Treatment technology of brominated epoxy resin (BER) is still a big challenge to waste printed circuit boards (PCBs) recycling. In order to make full use of the materials, ionic liquid 1-butyl-3-methyl imidazole chloride ([Bmim]Cl) was used to dissolve BER to separate glass fibers from PCB nonmetallic powders. The effects of dissolving parameters including temperature, time and solid/ liquid ratio on the dissolution rate of BER were investigated. The dissolved BER were regenerated and were characterized by FTIR and thermal analysis. Results showed that [Bmim]Cl was a good direct solvent for BER dissolution and at a suitable condition of 170°Cfor 6 hours with solid/liquid ratio of 1: 20 (g/g), nearly 90% of BER in original powders were dissolved. The possible dissolution mechanism was also discussed.


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