scholarly journals Three-dimensional phase-field study of grain coarsening and grain shape accommodation in the final stage of liquid-phase sintering

2017 ◽  
Vol 37 (5) ◽  
pp. 2265-2275 ◽  
Author(s):  
Hamed Ravash ◽  
Liesbeth Vanherpe ◽  
Jef Vleugels ◽  
Nele Moelans
2013 ◽  
Vol 45 (3) ◽  
pp. 261-271 ◽  
Author(s):  
B. Randjelovic ◽  
K. Shinagawa ◽  
Z.S. Nikolic

From many experiments with mixtures of small and large grains, it can be concluded that during liquid phase sintering, smaller grains partially dissolve and a solid phase precipitates on the larger grains and grain coarsening occurs. The growth rate can be controlled either by the solid-liquid phase boundary reaction or by diffusion through the liquid phase. The microstructure may change either by larger grains growing during the Ostwald ripening process or by shape accommodation. In this study, two-dimensional mathematical approach for simulation of grain coarsening by grain boundary migration based on a physical and corresponding numerical modeling of liquid phase sintering will be considered. A combined mathematical method of analyzing viscous deformation and solute diffusion in liquid bridge between two grains with different sizes will be proposed. The viscous FE method will be used for calculating meniscus of the liquid bridge, with the interfacial tensions taken into consideration. The FE method for diffusion will be also implemented by using the same mesh as the deformation analysis.


2010 ◽  
Vol 82 (2) ◽  
Author(s):  
Klaus Kassner ◽  
Rahma Guérin ◽  
Tristan Ducousso ◽  
Jean-Marc Debierre

Author(s):  
Catherine Shearer

Integrated package technologies continue to be the dominant trend in the electronics packaging industry. In particular, heterogeneous integration of logic and memory or sensing is an enormous growth segment for both mobile electronics and IoT applications. In the mobile microprocessor segment of the field, the most advanced technologies will be implemented in the early adopter class. New package architectures and interconnect schemes will be vetted and implemented without significant cost pressure, performance is the driver. In the IoT segment and downstream mobile, however; lower cost alternatives to cutting edge packaging architectures are needed to drive market growth. Sintering pastes offer an opportunity to cost-effectively enable cutting edge 3D package capability for a wider variety of applications. In this paper we will explore the use of transient liquid phase sintering (TLPS) pastes in package-on-package (POP) schemes for integrated logic with memory or sensing functions in through mold via architectures. Through mold via technology has been well established in the industry and has significantly contributed to the adoption of three dimensional packaging architectures. The advantages of using TLPS pastes in similar structures will be detailed.


2022 ◽  
Vol 204 ◽  
pp. 111173
Author(s):  
Ryo Yamada ◽  
Mikihiro Kudo ◽  
Geunwoo Kim ◽  
Tomohiro Takaki ◽  
Yasushi Shibuta ◽  
...  

2003 ◽  
Vol 48 (5) ◽  
pp. 635-639 ◽  
Author(s):  
Sona Kim ◽  
Seok-Hee Han ◽  
Jong-Ku Park ◽  
Hyoun-Ee Kim

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