Computer study of liquid phase sintering - three-dimensional time dependent rearrangement

Integrated package technologies continue to be the dominant trend in the electronics packaging industry. In particular, heterogeneous integration of logic and memory or sensing is an enormous growth segment for both mobile electronics and IoT applications. In the mobile microprocessor segment of the field, the most advanced technologies will be implemented in the early adopter class. New package architectures and interconnect schemes will be vetted and implemented without significant cost pressure, performance is the driver. In the IoT segment and downstream mobile, however; lower cost alternatives to cutting edge packaging architectures are needed to drive market growth. Sintering pastes offer an opportunity to cost-effectively enable cutting edge 3D package capability for a wider variety of applications. In this paper we will explore the use of transient liquid phase sintering (TLPS) pastes in package-on-package (POP) schemes for integrated logic with memory or sensing functions in through mold via architectures. Through mold via technology has been well established in the industry and has significantly contributed to the adoption of three dimensional packaging architectures. The advantages of using TLPS pastes in similar structures will be detailed.

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Three-dimensional simulation of isotropic coarsening in liquid phase sintering I: A model

Acta Materialia ◽

10.1016/j.actamat.2006.08.054 ◽

2007 ◽

Vol 55 (2) ◽

pp. 615-626 ◽

Cited By ~ 19

Author(s):

S LEE ◽

J RICKMAN ◽

A ROLLETT

Keyword(s):

Liquid Phase ◽

Three Dimensional ◽

Liquid Phase Sintering ◽

Dimensional Simulation

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Densification and volumetric change during supersolidus liquid phase sintering of prealloyed brass Cu28Zn powder: Modeling and optimization

Science of Sintering ◽

10.2298/sos1401023m ◽

2014 ◽

Vol 46 (1) ◽

pp. 23-35 ◽

Cited By ~ 17

Author(s):

A. Mohammadzadeh ◽

M. Azadbeh ◽

Sabahi Namini

Keyword(s):

Response Surface Methodology ◽

Liquid Phase ◽

Response Surface ◽

Three Dimensional ◽

Liquid Phase Sintering ◽

Central Composite Rotatable Design ◽

Volumetric Change ◽

Short Period ◽

Central Composite ◽

Rotatable Design

An investigation has been made to use response surface methodology and central composite rotatable design for modeling and optimizing the effect of sintering variables on densification of prealloyed Cu28Zn brass powder during supersolidus liquid phase sintering. The mathematical equations were derived to predict sintered density, densification parameter, porosity percentage and volumetric change of samples using second order regression analysis. As well as the adequacy of models was evaluated by analysis of variance technique at 95% confidence level. Finally, the influence and interaction of sintering variables, on achieving any desired properties was demonstrated graphically in contour and three dimensional plots. In order to better analyze the samples, microstructure evaluation was carried out. It was concluded that response surface methodology based on central composite rotatable design, is an economical way to obtain arbitrary information with performing the fewest number of experiments in a short period of time.

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