Controlling lead release due to uniform and galvanic corrosion — An evaluation of silicate-based inhibitors

2021 ◽  
Vol 407 ◽  
pp. 124707
Author(s):  
Bofu Li ◽  
Benjamin F. Trueman ◽  
Mohammad Shahedur Rahman ◽  
Graham A. Gagnon
Keyword(s):  
Galvanic Corrosion ◽  
Lead Release

Effect of connection methods on lead release from galvanic corrosion

2013 ◽  
Vol 105 (7) ◽  
pp. E337-E351 ◽  
Author(s):  
Yin Wang ◽  
Vrajesh Mehta ◽  
Gregory J. Welter ◽  
Daniel E. Giammar
Keyword(s):  
Galvanic Corrosion ◽  
Lead Release

Copper-Induced Metal Release from Lead Pipe into Drinking Water

CORROSION ◽  
10.5006/0616 ◽  
2012 ◽  
Vol 68 (11) ◽  
pp. 1037-1048 ◽  
Author(s):  
J. Hu ◽  
F. Gan ◽  
S. Triantafyllidou ◽  
C.K. Nguyen ◽  
M.A. Edwards
Keyword(s):  
Significant Contribution ◽  
Galvanic Corrosion ◽  
Lead Contamination ◽  
Stagnant Water ◽  
Galvanic Current ◽  
Bench Scale ◽  
Lead Pipe ◽  
Lead Pipes ◽  
Water Ph ◽  
Lead Release

The effect of added cupric ions (0 mg/L to 5 mg/L Cu+2) on possible deposition corrosion of lead pipe was investigated in bench-scale experiments under flowing and stagnant water conditions. Under stagnation the presence of cupric ions in the water feeding lead pipes marginally increased lead release into the water, but under continuous recirculation it could increase lead release by orders of magnitude. Other bench-scale experiments investigated galvanic corrosion between lead and copper pipes under stagnation, confirming that water chemistry (particularly the chloride-to-sulfate mass ratio [CSMR]) is a controlling factor in either “strengthening” galvanic corrosion and increasing water lead contamination by orders of magnitude (high CSMR water) or “weakening” the galvanic effect with less but still significant contribution to water lead contamination (low CSMR water). Longitudinal water pH measurements along the length of the galvanic rigs revealed a significant pH drop close to the lead:copper junction at relatively short stagnation times in high CSMR water, which is consistent with the observations of higher lead leaching and higher galvanic current measured in that situation.

Investigation of Lead Levels in Potable Water from Faucets, Water Fountains and Water Dispensers Using Various Sampling Protocols in Schools

Impact ◽  
2020 ◽  
Vol 2020 (7) ◽  
pp. 50-52
Author(s):  
Ding-Quan Ng ◽  
Yi-Pin Lin
Keyword(s):  
Drinking Water ◽  
Research Team ◽  
Potable Water ◽  
Galvanic Corrosion ◽  
Assistant Professor ◽  
Lead Contamination ◽  
University Of Technology ◽  
Sampling Protocols ◽  
Lead Levels ◽  
Lead Release

Lead contamination is an example of how elements that leach into drinking water can lead to considerable health problems in local communities. A research team led by Assistant Professor Ding-Quan Ng, from Chaoyang University of Technology, has been investigating the levels of lead found in drinking water in schools. They are also investigating lead release that occurs as a result of galvanic corrosion into potable water. Ng and his colleagues hope to shine a light on the dangers of lead contamination in drinking water supplies and seek to use their findings to promote the establishment of new regulations and policies to improve monitoring of water quality to local needs.

Effects of pH value, chloride and sulfate concentrations on galvanic corrosion between lead and copper in drinking water

2016 ◽  
Vol 13 (4) ◽  
pp. 602 ◽  
Author(s):  
Ding-Quan Ng ◽  
Yi-Pin Lin
Keyword(s):  
Drinking Water ◽  
Distribution Systems ◽  
Lead Concentration ◽  
Ph Value ◽  
Galvanic Corrosion ◽  
Corrosion Products ◽  
Lead Contamination ◽  
Lead Corrosion ◽  
Effects Of Ph ◽  
Lead Release

Environmental context Galvanic corrosion has been recently reported as the main cause of lead contamination in drinking water in urban cities. Conditions that can deter or promote galvanic corrosion, however, are not well understood. Fundamental investigations exploring the mechanisms and processes involved in galvanic corrosion in drinking water could help to implement proper corrective measures to safeguard public health from lead contamination. Abstract This study investigates the effects of pH value, chloride and sulfate concentrations on galvanic corrosion between lead and copper in drinking water. We hypothesised that galvanic corrosion would occur immediately when a lead–copper couple is first formed and that the release of lead would be suppressed by the subsequent formation of lead corrosion products. Therefore, unlike previous long-term studies using harvested lead pipes, batch experiments employing high-purity lead and copper (99.9%) wires under stagnant and completely mixed conditions were conducted for a 7-day period to test our hypotheses. It was found that enhanced lead release was indeed observed after the lead–copper couple was formed and the lead profiles after 48h were strongly influenced by lead corrosion products formed in the system. Under stagnant conditions, reducing pH and increasing either chloride or sulfate concentrations promoted lead release, leading to the formation of lead corrosion products such as cerussite and hydrocerussite as experiments proceeded. The effect of chloride concentration on total lead concentration measured in the aqueous phase was similar to that of sulfate at the same molar concentration, showing that the chloride-to-sulfate mass ratio may not provide a good indication for total lead concentration in water. This study provides essential information on fundamental mechanisms and processes involved in galvanic corrosion in drinking water and may be used to explain related phenomena observed in real drinking-water distribution systems.

Impact of galvanic corrosion on lead release from aged lead service lines

2012 ◽  
Vol 46 (16) ◽  
pp. 5049-5060 ◽  
Author(s):  
Yin Wang ◽  
He Jing ◽  
Vrajesh Mehta ◽  
Gregory J. Welter ◽  
Daniel E. Giammar
Keyword(s):  
Galvanic Corrosion ◽  
Lead Release

Corrosion of Electronic and Magnetic Devices and Materials

1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel
Keyword(s):  
Thin Film ◽  
Failure Modes ◽  
Galvanic Corrosion ◽  
Potential Drop ◽  
Magnetic Devices ◽  
Disk Structure ◽  
Magnetic Layers ◽  
Ohmic Potential Drop ◽  
Corrosion Problem ◽  
Corrosion Susceptibility

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.

Development of corrosion flaws for the production of realistic test specimens

2020 ◽  
Vol 64 (1) ◽  
pp. 23-28
Author(s):  
J. Hodač ◽  
Z. Fulín ◽  
P. Mareš ◽  
J. Veselá ◽  
O. Chocholatý
Keyword(s):  
Power Plants ◽  
Galvanic Corrosion ◽  
Water Solution ◽  
Erosive Wear ◽  
Corrosion Damage ◽  
Water Mist ◽  
Carbon Steels ◽  
Bending Stress ◽  
Solution Flow ◽  
Mechanical Bending

AbstractTo produce realistic test specimens with realistic flaws, it is necessary to develop appropriate procedure for corrosion flaw production. Tested specimens are made from steels commonly used in power plants, such as carbon steels, stainless steels and their dissimilar weldments. In this study, corrosion damage from NaCl water solution and NaCl water mist are compared. Specimens were tested with and without mechanical bending stress. The corrosion processes produced plane, pitting and galvanic corrosion. On dissimilar weldments galvanic corrosion was observed and resulted to the deepest corrosion damage. Deepest corrosion flaws were formed on welded samples. The corrosion rate was also affected by the solution flow in a contact with the specimens, which results in a corrosion-erosive wear. Produced flaws are suitable as natural crack initiators or as realistic corrosion flaws in test specimens.

Studies on a Failure Analysis Flow of Surface Contamination, Corrosion, and Underetch on Microchip Al Bondpads in Wafer Fabrication

2005 ◽  
Author(s):  
Hua Younan
Keyword(s):  
Failure Analysis ◽  
Galvanic Corrosion ◽  
Surface Contamination ◽  
Wafer Fabrication ◽  
Tof Sims ◽  
Corrosion Passivation

Abstract A failure analysis flow is developed for surface contamination, corrosion and underetch on microchip Al bondpads and it is applied in wafer fabrication. SEM, EDX, Auger, FTIR, XPS and TOF-SIMS are used to identify the root causes. The results from carbon related contamination, galvanic corrosion, fluorine-induced corrosion, passivation underetch and Auger bondpad monitoring will be presented. The failure analysis flow will definitely help us to select suitable methods and tools for failure analysis of Al bondpad-related issues, identify rapidly possible root causes of the failures and find the eliminating solutions at both wafer fabrication and assembly houses.

Sign in / Sign up

Export Citation Format

Share Document