Asymptotic behaviour of a Bingham fluid in thin layers

Renata Bunoiu; Srinivasan Kesavan

doi:10.1016/j.jmaa.2003.10.049

Asymptotic Behaviour for Dirichlet Problems in Domains Bounded by Thin Layers

Partial Differential Equations and the Calculus of Variations ◽

10.1007/978-1-4684-9196-8_8 ◽

1989 ◽

pp. 193-249 ◽

Cited By ~ 2

Author(s):

Giuseppe Buttazzo ◽

Gianni Dal Maso ◽

Umberto Mosco

Keyword(s):

Asymptotic Behaviour ◽

Thin Layers ◽

Dirichlet Problems

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Stochastic reinforcement problems and ergodic theory

Proceedings of the Royal Society of Edinburgh Section A Mathematics ◽

10.1017/s030821050001413x ◽

1992 ◽

Vol 121 (1-2) ◽

pp. 33-53 ◽

Cited By ~ 1

Author(s):

M. Balzano ◽

G. Paderni

Keyword(s):

Asymptotic Behaviour ◽

Ergodic Theory ◽

Random Function ◽

Limit Problem ◽

Thin Layers ◽

Ergodic Theorems ◽

Dirichlet Problems

SynopsisWe study the asymptotic behaviour of Dirichlet problems in domains of R2 bounded by thin layers whose thickness is given by means of an assigned ergodic random function. Using a capacitary method together with ergodic theorems for additive and superadditive processes, we are able to characterise the limit problem precisely.

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Asymptotic Behaviour for Dirichlet Problems in Domains Bounded by Thin Layers

Partial Differential Equations and the Calculus of Variations ◽

10.1007/978-1-4615-9828-2_8 ◽

1989 ◽

pp. 193-249 ◽

Cited By ~ 1

Author(s):

Giuseppe Buttazzo ◽

Gianni Dal Maso ◽

Umberto Mosco

Keyword(s):

Asymptotic Behaviour ◽

Thin Layers ◽

Dirichlet Problems

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Asymptotic behaviour of a viscoplastic bingham fluid in porous media with periodic structure

Annales de la faculté des sciences de Toulouse Mathématiques ◽

10.5802/afst.668 ◽

1989 ◽

Vol 10 (1) ◽

pp. 37-64

Author(s):

Alain Brillard

Keyword(s):

Porous Media ◽

Asymptotic Behaviour ◽

Periodic Structure ◽

Bingham Fluid

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Remarks on the asymptotic behaviour of solutions to the compressible Navier–Stokes equations in the half-line

Proceedings of the Royal Society of Edinburgh Section A Mathematics ◽

10.1017/s030821050200032x ◽

2002 ◽

Vol 132 (03) ◽

pp. 627

Keyword(s):

Asymptotic Behaviour ◽

Stokes Equations ◽

Half Line ◽

Navier Stokes ◽

Navier Stokes Equations ◽

Asymptotic Behaviour Of Solutions

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Immunoferritin localization of intracellular antigens in positively stained frozen sections

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s042482010008170x ◽

1978 ◽

Vol 36 (2) ◽

pp. 168-169

Author(s):

K. T. Tokuyasu

Keyword(s):

Surface Tension ◽

Water Surface ◽

Thin Layers ◽

The Other ◽

Positive Staining ◽

Frozen Sections ◽

The Past ◽

Ultrathin Frozen Sections ◽

Definition Of

During the past investigations of immunoferritin localization of intracellular antigens in ultrathin frozen sections, we found that the degree of negative staining required to delineate u1trastructural details was often too dense for the recognition of ferritin particles. The quality of positive staining of ultrathin frozen sections, on the other hand, has generally been far inferior to that attainable in conventional plastic embedded sections, particularly in the definition of membranes. As we discussed before, a main cause of this difficulty seemed to be the vulnerability of frozen sections to the damaging effects of air-water surface tension at the time of drying of the sections.Indeed, we found that the quality of positive staining is greatly improved when positively stained frozen sections are protected against the effects of surface tension by embedding them in thin layers of mechanically stable materials at the time of drying (unpublished).

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EELS Measurement of the Local Electronic Structure of Copper Atoms Segregated to Aluminum Grain Boundaries

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100164179 ◽

1996 ◽

Vol 54 ◽

pp. 342-343

Author(s):

S.J. Splinter ◽

J. Bruley ◽

P.E. Batson ◽

D.A. Smith ◽

R. Rosenberg

Keyword(s):

Electronic Structure ◽

Grain Boundaries ◽

Boundary Segregation ◽

Thin Layers ◽

Nominal Composition ◽

Spatially Resolved ◽

Service Lifetime ◽

Heat Treated ◽

Probe Size ◽

Local Electronic Structure

It has long been known that the addition of Cu to Al interconnects improves the resistance to electromigration failure. It is generally accepted that this improvement is the result of Cu segregation to Al grain boundaries. The exact mechanism by which segregated Cu increases service lifetime is not understood, although it has been suggested that the formation of thin layers of θ-CuA12 (or some metastable substoichiometric precursor, θ’ or θ”) at the boundaries may be necessary. This paper reports measurements of the local electronic structure of Cu atoms segregated to Al grain boundaries using spatially resolved EELS in a UHV STEM. It is shown that segregated Cu exists in a chemical environment similar to that of Cu atoms in bulk θ-phase precipitates.Films of 100 nm thickness and nominal composition Al-2.5wt%Cu were deposited by sputtering from alloy targets onto NaCl substrates. The samples were solution heat treated at 748K for 30 min and aged at 523K for 4 h to promote equilibrium grain boundary segregation. EELS measurements were made using a Gatan 666 PEELS spectrometer interfaced to a VG HB501 STEM operating at 100 keV. The probe size was estimated to be 1 nm FWHM. Grain boundaries with the narrowest projected width were chosen for analysis. EDX measurements of Cu segregation were made using a VG HB603 STEM.

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