A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints

2020 ◽  
Vol 54 ◽  
pp. 221-227
Author(s):  
Waluyo Adi Siswanto ◽  
M. Arun ◽  
Irina V. Krasnopevtseva ◽  
A. Surendar ◽  
Andino Maseleno
Keyword(s):  
Joule Heating ◽  
Microstructure Evolution ◽  
Solder Joints ◽  
Stress Triaxiality ◽  
Snagcu Solder

Joule heating-induced microstructure evolution and residual stress in Ti-6Al-4V for U-shaped screw

Vacuum ◽  
2018 ◽  
Vol 153 ◽  
pp. 70-73 ◽  
Author(s):  
Hui Shao ◽  
Di Shan ◽  
Lijing Bai ◽  
Guojun Zhang ◽  
Kaixuan Wang ◽  
...  
Keyword(s):  
Residual Stress ◽  
Joule Heating ◽  
Microstructure Evolution

Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

2007 ◽  
Vol 47 (12) ◽  
pp. 2161-2168 ◽  
Author(s):  
Weiqun Peng ◽  
Eduardo Monlevade ◽  
Marco E. Marques
Keyword(s):  
Thermal Aging ◽  
Solder Joints ◽  
Interfacial Structure ◽  
Snagcu Solder

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010 ◽  
Vol 25 (7) ◽  
pp. 1312-1320 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Fracture Energy ◽  
Microstructure Evolution ◽  
Thermal Cycle ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Solder Joints ◽  
Whisker Formation ◽  
Structural Variations ◽  
Before And After ◽  
Ball Joints

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

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