Interaction of 〈100〉 and ½〈111〉 dislocation loops with point defects in ferritic alloys

2008 ◽  
Vol 377 (1) ◽  
pp. 141-146 ◽  
Author(s):  
D. Terentyev ◽  
L. Malerba
Author(s):  
Byung-Teak Lee

Grown-in dislocations in GaAs have been a major obstacle in utilizing this material for the potential electronic devices. Although it has been proposed in many reports that supersaturation of point defects can generate dislocation loops in growing crystals and can be a main formation mechanism of grown-in dislocations, there are very few reports on either the observation or the structural analysis of the stoichiometry-generated loops. In this work, dislocation loops in an arsenic-rich GaAs crystal have been studied by transmission electron microscopy.The single crystal with high arsenic concentration was grown using the Horizontal Bridgman method. The arsenic source temperature during the crystal growth was about 630°C whereas 617±1°C is normally believed to be optimum one to grow a stoichiometric compound. Samples with various orientations were prepared either by chemical thinning or ion milling and examined in both a JEOL JEM 200CX and a Siemens Elmiskop 102.


Author(s):  
L. J. Sykes ◽  
J. J. Hren

In electron microscope studies of crystalline solids there is a broad class of very small objects which are imaged primarily by strain contrast. Typical examples include: dislocation loops, precipitates, stacking fault tetrahedra and voids. Such objects are very difficult to identify and measure because of the sensitivity of their image to a host of variables and a similarity in their images. A number of attempts have been made to publish contrast rules to help the microscopist sort out certain subclasses of such defects. For example, Ashby and Brown (1963) described semi-quantitative rules to understand small precipitates. Eyre et al. (1979) published a catalog of images for BCC dislocation loops. Katerbau (1976) described an analytical expression to help understand contrast from small defects. There are other publications as well.


2005 ◽  
Vol 237-240 ◽  
pp. 659-664
Author(s):  
Frédéric Christien ◽  
Alain Barbu

Irradiation of metals leads to the formation of point-defects (vacancies and selfinterstitials) that usually agglomerate in the form of dislocation loops. Due to the elastic interaction between SIA (self-interstitial atoms) and dislocations, the loops absorb in most cases more SIA than vacancies. That is why the loops observed by transmission electron microscopy are almost always interstitial in nature. Nevertheless, vacancy loops have been observed in zirconium following electron or neutron irradiation (see for example [1]). Some authors proposed that this unexpected behavior could be accounted for by SIA diffusion anisotropy [2]. Following the approach proposed by Woo [2], the cluster dynamics model presented in [3] that describes point defect agglomeration was extended to the case where SIA diffusion is anisotropic. The model was then applied to the loop microstructure evolution of a zirconium thin foil irradiated with electrons in a high-voltage microscope. The main result is that, due to anisotropic SIA diffusion, the crystallographic orientation of the foil has considerable influence on the nature (vacancy or interstitial) of the loops that form during irradiation.


1991 ◽  
Vol 235 ◽  
Author(s):  
H. Suematsu ◽  
T. E. Mitchell ◽  
T. Iseki ◽  
T. Yano

ABSTRACTPressureless-sintered AlN was neutron irradiated and the hardness change was examined by Vickers indentation. The hardness was increased by irradiation. When the samples were annealed at high temperature, the hardness gradually decreased. Length was also found to increase and to change in the same way as the hardness. A considerable density of dislocation loops still remained, even after the hardness completely recovered to the value of the unirradiated sample. Thus, it is concluded that the hardening in AlN is caused by isolated point defects and small clusters of point defects, rather than by dislocation loops.Hardness was found to increase in proportion to the length change. If the length change is assumed to be proportional to the point defect density, then the curve could be fitted qualitatively to that predicted by models of solution hardening in metals. Furthermore, the curves for three samples irradiated at different temperatures and fluences are identical. There should be different kinds of defect clusters in samples irradiated at different conditions, e.g, the fraction of single point defects is the highest in the sample irradiated at the lowest temperature. Thus, hardening is insensitive to the kind of defects remaining in the sample and is influenced only by those which contribute to length change.


1960 ◽  
Vol 5 (2) ◽  
pp. 50-51 ◽  
Author(s):  
S. Amelinckx ◽  
P. Delavignette

1996 ◽  
Vol 439 ◽  
Author(s):  
A. Hardouin-Duparc ◽  
A. Barbu

AbstractIn low copper steels for nuclear reactor pressure vessel, point defect clustering seems to play an important role in hardening. In order to study the hardening component which results from the clustering of freely migrating point defects, we irradiated, in a high voltage electron microscope, Fe, the alloys Fe0.13%Cu and Fe0.014%P, alloys and the alloy Fel.5%Mn0.8%Ni0.1%Cu0.01%P, the composition of which is close to the matrix of pressure vessel steels. We studied the nucleation of dislocation loops and their growth velocity. We find out that copper and phosphorus have no effect on the vacancy migration energy but that this parameter decreased significantly in the complex alloy. The main point is certainly that loops are nucleated in the complex model alloy up to 500°C while no loop appears above 300°C in Fe and in FeCu. FeP shows an intermediate behavior.


1997 ◽  
Vol 469 ◽  
Author(s):  
H. S. Chao ◽  
P. B. Griffin ◽  
J. D. Plummer

ABSTRACTThe transient enhanced diffusion behavior of B after ion implantation above the amorphization threshold is investigated. The experimental structure uses a layer of epitaxially grown Si, uniformly doped with B to act as a diffusion monitor. Wafers using this structure are implanted with amorphizing doses of Si, As, or P and annealed for various times at various temperatures. The experimental results show that upon annealing after Si implantation, there is a large amount of B pile-up that occurs at the amorphous/crystalline (A/C) interface while B is depleted from the region just beyond the A/C interface. This pile-up/depletion phenomenon can be attributed to the dislocation loops that form at the A/C interface. These loops act as sinks for interstitial point defects. There is also B pile-up/depletion behavior for As and P implants as well. However, this behavior may be explained by an electric field enhancement effect. While dislocation loops are known to form at the A/C interface for all of the investigated implant conditions, it appears that while they are necessary to simulate for Si amorphizing implants, they may not be necessary to simulate for As and P amorphizing implants.


2015 ◽  
Vol 460 ◽  
pp. 82-96 ◽  
Author(s):  
M. Christensen ◽  
W. Wolf ◽  
C. Freeman ◽  
E. Wimmer ◽  
R.B. Adamson ◽  
...  

1992 ◽  
Vol 262 ◽  
Author(s):  
H. L. Meng ◽  
S. Prusstn ◽  
K. S. Jones

ABSTRACTPrevious results [1] have shown that type II (end-of-range) dislocation loops can be used as point defect detectors and are efficient in measuring oxidation induced point defects. This study investigates the interaction between oxidation-induced point defects and dislocation loops when Ge+ implantation was used to form the type II dislocation loops. The type II dislocation loops were introduced via Ge+ implants into <100> Si wafers at 100 keV to at doses ranging from 2×1015 to l×1016/cm2. The subsequent furnace annealing at 900 °C was done for times between 30 min and 4 hr in either a dry oxygen or nitrogen ambient. The change in atom concentration bound by dislocation loops as a result of oxidation was measured by plan-view transmission electron microscopy (PTEM). The results show that the oxidation rate for Ge implanted Si is similar to Si+ implanted Si. Upon oxidation a decrease in the interstitial injection was observed for the Ge implanted samples relative to the Si implanted samples. With increasing Ge+ dose the trapped atom concentration bound by the loops actually decreases upon oxidation relative to the inert ambient implying oxidation of Ge+ implanted silicon can result in either vacancy injection or the formation of an interstitial sink.


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