Deuterium retention on He-irradiated F82H with surface impurity layer

The surface morphology of pure W bulks and nanocrystalline tungsten films was investigated after exposure to a low-energy (100 eV/D), high-flux (1.8 × 1021 D·m−2s−1) deuterium plasma. Nanocrystalline tungsten films of 6 μm thickness were deposited on tungsten bulks and exposed to deuterium plasma at various fluences ranging from 1.30 × 1025 to 5.18 × 1025 D·m−2. Changes in surface morphology from before to after irradiation were studied with scanning electron microscopy (SEM). The W bulk exposed to low-fluence plasma (1.30 × 1025 D·m−2) shows blisters. The blisters on the W bulk irradiated to higher-fluence plasma are much larger (~2 µm). The blisters on the surface of W films are smaller in size and lower in density than those of the W bulks. In addition, the modifications exhibit the appearance of cracks below the surface after deuterium plasma irradiation. It is suggested that the blisters are caused by the diffusion and aggregation of the deuterium-vacancy clusters. The deuterium retention of the W bulks and nanocrystalline tungsten films was studied using thermal desorption spectroscopy (TDS). The retention of deuterium in W bulks and W films increases with increasing deuterium plasma fluence when irradiated at 500 K.

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The high-flux effect on deuterium retention in TiC and TaC doped tungsten at high temperatures

Journal of Nuclear Materials ◽

10.1016/j.jnucmat.2017.07.028 ◽

2017 ◽

Vol 494 ◽

pp. 211-218 ◽

Cited By ~ 7

Author(s):

Mikhail Zibrov ◽

Kirill Bystrov ◽

Matej Mayer ◽

Thomas W. Morgan ◽

Hiroaki Kurishita

Keyword(s):

High Temperatures ◽

High Flux ◽

Deuterium Retention

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Deuterium retention in mixed C–W–D films co-deposited in magnetron discharge in deuterium

Journal of Nuclear Materials ◽

10.1016/j.jnucmat.2013.03.034 ◽

2013 ◽

Vol 438 (1-3) ◽

pp. 204-208 ◽

Cited By ~ 4

Author(s):

S. Krat ◽

Yu Gasparyan ◽

V. Efimov ◽

A. Mednikov ◽

M. Zibrov ◽

...

Keyword(s):

Magnetron Discharge ◽

Deuterium Retention

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Deuterium retention in sintered boron carbide exposed to a deuterium plasma

Journal of Nuclear Materials ◽

10.1016/j.jnucmat.2005.11.002 ◽

2006 ◽

Vol 349 (3) ◽

pp. 282-290 ◽

Cited By ~ 4

Author(s):

V.Kh. Alimov ◽

D.A. Komarov ◽

J. Roth ◽

M. Mayer ◽

S. Lindig

Keyword(s):

Boron Carbide ◽

Deuterium Plasma ◽

Deuterium Retention ◽

Sintered Boron

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Examination of Thick-Films Using Modern Surface Analytical Techniques

ElectroComponent Science and Technology ◽

10.1155/apec.11.219 ◽

1984 ◽

Vol 11 (3) ◽

pp. 219-223 ◽

Cited By ~ 2

Author(s):

G. Harsányi ◽

G. Ripka

Keyword(s):

Integrated Circuits ◽

Thick Film ◽

Analytical Methods ◽

Thick Films ◽

Analytical Techniques ◽

Electrical Measurements ◽

Surface Impurity ◽

And Migration

Modern surface analytical methods/EMPA, AES, SIMS etc. were used for studying the different layers in thick-film integrated circuits. Diffusion and migration effects, surface impurity distributions and surface compositions were examined. Some of the results are presented in this paper. Electrical measurements are not discussed here; only examples of the practical use of the methods are demonstrated.

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