An electro-mechanical impedance model of a cracked composite beam with adhesively bonded piezoelectric patches

The article presents a literature review of electromechanical impedance spectroscopy for structural health monitoring, with emphasis in adhesively bonded joints. The concept behind electromechanical impedance spectroscopy is to use variable high-frequency structural vibrations with piezoelectric elements to monitor the local area of a structure for changes in mechanical impedance that may indicate imminent damage. Various mathematical models that correlate the structural impedance with the electric response of the piezoelectric sensors are presented. Several algorithms and metrics are introduced to detect, localize, and characterize damage when using electromechanical impedance spectroscopy. Applications of electromechanical impedance spectroscopy to study adhesive joints are described. Research and development of alternative hardware for electromechanical impedance spectroscopy is presented. The article ends by presenting future prospects and research of electromechanical impedance spectroscopy–based structural health monitoring, and, while advances have been made in algorithms for damage detection, localization, and characterization, this technology is not mature enough for real-world applications.

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Modeling of the Electro-Mechanical (E/M) Impedance Response of a Damaged Composite Beam

10.1115/imece1999-0525 ◽

1999 ◽

Author(s):

Victor Giurgiutiu ◽

Craig A. Rogers

Keyword(s):

Composite Beam ◽

Dynamic Stiffness ◽

Normal Modes ◽

Mechanical Impedance ◽

Impedance Method ◽

Stiffness Ratio ◽

The Real ◽

Active Sensor ◽

Impedance Response ◽

Resonance Frequencies

Abstract The electro-mechanical (E/M) impedance method has gained acceptance as an effective technique for structural health monitoring, damage detection, and failure prevention. In spite of extensive experimental validation of this novel method, very little work has been dedicated to its modeling. This paper develops a model of the E/M impedance response of a damaged composite beam interrogated by a PZT wafer active sensor. The electromechanical model for the interaction between the beam and the active sensor is developed from first principles. The effective axial force and bending moments induced by the PZT wafer into the beam are considered. Equations of motion for the flexural vibrations of a composite beam under moment excitation are developed. Solution in terms of normal modes with internal damping is obtained. The resulting response and the applied force are utilized to deduce general expressions for pointwise dynamic stiffness and pointwise dynamic compliance. Effective stiffness of the PZT wafer is also calculated, and the complex stiffness ratio for the PZT-structure interaction is determined. Hence, the complex electro-mechanical impedance and admittance are deduced. A numerical example is given to illustrate the method and test its effectiveness. It is found that the real part of the effective pointwise dynamic stiffness interacts at par with the PZT stiffness at structural resonance frequencies. The imaginary part of the complex stiffness ratio directly reflects the pointwise structural resonances. Consequently, the real part of the electro-mechanical impedance directly reflects the pointwise structural resonances too. The same behavior is also found in the electro-mechanical admittance. Thus, the real part of the E/M impedance and the real part of the E/M admittance are found to be direct measures of the structural response, reflective of damage presence.

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Simplified Impedance Model for Adhesively Bonded Piezo-Impedance Transducers

Journal of Aerospace Engineering ◽

10.1061/(asce)0893-1321(2009)22:4(373) ◽

2009 ◽

Vol 22 (4) ◽

pp. 373-382 ◽

Cited By ~ 20

Author(s):

Suresh Bhalla ◽

Praveen Kumar ◽

Ashok Gupta ◽

Tushar K. Datta

Keyword(s):

Adhesively Bonded ◽

Impedance Model

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A BODY MASS DEPENDENT MECHANICAL IMPEDANCE MODEL FOR APPLICATIONS IN VIBRATION SEAT TESTING

Journal of Sound and Vibration ◽

10.1006/jsvi.2001.4258 ◽

2002 ◽

Vol 253 (1) ◽

pp. 243-264 ◽

Cited By ~ 34

Author(s):

P.-É. BOILEAU ◽

S. RAKHEJA ◽

X. WU

Keyword(s):

Body Mass ◽

Mechanical Impedance ◽

Impedance Model ◽

Mass Dependent

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Mechanical Impedance Analysis of a Novel MEMS Photon Force Sensor

Proceedings ◽

10.3390/proceedings2130921 ◽

2018 ◽

Vol 2 (13) ◽

pp. 921

Author(s):

Karolina Orłowska ◽

Wojciech Majstrzyk ◽

Andrzej Sierakowski ◽

Tomasz Piasecki ◽

Teodor Gotszalk

Keyword(s):

Pressure Effect ◽

Mechanical Impedance ◽

Impedance Analysis ◽

Force Sensor ◽

Laser Vibrometer ◽

Radiation Beam ◽

Impedance Model ◽

Mems Sensor ◽

Thermal Actuation ◽

Low K

In this work we present how to describe mechanical impedance of a photon force (PF) MEMS sensor dedicated to structures’ optomechanical studies. An actuating force (photon force) is caused by the reflection and absorption of the electromagnetic radiation beam due to the radiation pressure effect. Specially designed very soft (low k-constant, ca 10–150 mN/m) cantilevers are presented. The structures integrate a Lorentz loop, which enables electromagnetic actuation. The construction with two mirrors is proposed so that parasitic thermal actuation can be neglected. The MEMS displacement is measured with the use of a laser vibrometer. The mechanical impedance model is presented using which the stiffness is calculated. As validation measurements: thermal noise and known mass adding methods are used.

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