Effect of annealing temperature on microstructure and corrosion behavior of CoCrFeMnNi high-entropy alloy in alkaline soil simulation solution

Author(s):  
Min Zhu ◽  
Baozhu Zhao ◽  
Yongfeng Yuan ◽  
Simin Yin ◽  
Shaoyi Guo ◽  
...  
2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Ruei-Cheng Lin ◽  
Tai-Kuang Lee ◽  
Der-Ho Wu ◽  
Ying-Chieh Lee

Ni-Cr-Si-Al-Ta resistive thin films were prepared on glass and Al2O3substrates by DC magnetron cosputtering from targets of Ni0.35-Cr0.25-Si0.2-Al0.2casting alloy and Ta metal. Electrical properties and microstructures of Ni-Cr-Si-Al-Ta films under different sputtering powers and annealing temperatures were investigated. The phase evolution, microstructure, and composition of Ni-Cr-Si-Al-Ta films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). When the annealing temperature was set to 300°C, the Ni-Cr-Si-Al-Ta films with an amorphous structure were observed. When the annealing temperature was at 500°C, the Ni-Cr-Si-Al-Ta films crystallized into Al0.9Ni4.22, Cr2Ta, and Ta5Si3phases. The Ni-Cr-Si-Al-Ta films deposited at 100 W and annealed at 300°C which exhibited the higher resistivity 2215 μΩ-cm with −10 ppm/°C of temperature coefficient of resistance (TCR).


2018 ◽  
Vol 54 (5) ◽  
pp. 4433-4443 ◽  
Author(s):  
Rajesh K. Mishra ◽  
P. P. Sahay ◽  
Rohit R. Shahi

2019 ◽  
Vol 157 ◽  
pp. 109887 ◽  
Author(s):  
Shengyu Chen ◽  
Zhaobing Cai ◽  
Zhaoxia Lu ◽  
Jibin Pu ◽  
Ran Chen ◽  
...  

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