Physical simulation of interfacial microstructure evolution for hot compression bonding behavior in linear friction welded joints of GH4169 superalloy

2016 ◽  
Vol 104 ◽  
pp. 436-452 ◽  
Author(s):  
Xiawei Yang ◽  
Wenya Li ◽  
Yan Feng ◽  
Siqi Yu ◽  
Bo Xiao
Keyword(s):  
Microstructure Evolution ◽  
Welded Joints ◽  
Physical Simulation ◽  
Interfacial Microstructure ◽  
Hot Compression ◽  
Linear Friction ◽  
Gh4169 Superalloy

scholarly journals Experimental and Numerical Study of the Effects of the Reversal Hot Rolling Conditions on the Recrystallization Behavior of Austenite Model Alloys

Metals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 26
Author(s):  
Krzysztof Muszka ◽  
Mateusz Sitko ◽  
Paulina Lisiecka-Graca ◽  
Thomas Simm ◽  
Eric Palmiere ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Hot Rolling ◽  
Strain Path ◽  
Physical Simulation ◽  
Numerical Study ◽  
Kinematic Hardening ◽  
Process Window ◽  
Recrystallization Behavior ◽  
Full Field ◽  
Strain Reversal

The experimental and numerical study of the effects of the recrystallization behavior of austenite model alloys during hot plate rolling on reverse rolling is the main goal of the paper. The computer models that are currently applied for simulation of reverse rolling are not strain-path-sensitive, thus leading to overestimation of the processing parameters outside the accepted process window (e.g., deformation in the partial austenite recrystallization region). Therefore, in this work, a particular focus is put on the investigation of strain path effects that occur during hot rolling and their influence on the microstructure evolution and mechanical properties of microalloyed austenite. Both experimental and numerical techniques are employed in this study, taking advantage of the integrated computational material engineering concept. The combined isotropic–kinematic hardening model is used for the macroscale predictions to take into account softening effects due to strain reversal. The macroscale model is additionally enriched with the full-field microstructure evolution model within the cellular automata framework. Examples of obtained results, highlighting the role of the strain reversal on the microstructural response, are presented within the paper. The combination of the physical simulation of austenitic model alloys and computer modeling provided new insights into optimization of the processing routes of advanced high-strength steels (AHSS).

Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes

2011 ◽  
Vol 239-242 ◽  
pp. 2976-2980 ◽  
Author(s):  
Ying Hui Zhang ◽  
Jing Qin ◽  
Hong Jin Zhao ◽  
Gao Lei Xu
Keyword(s):  
Intermetallic Compounds ◽  
Incubation Period ◽  
Microstructure Evolution ◽  
Diffusion Zone ◽  
Interfacial Microstructure ◽  
Combination Process ◽  
Local Areas

The interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied. It was found that the formation and growth of intermetallic compounds in the interface during metallurgical combination process have four stages: the incubation period, the formation of island-like new phases in local areas, the transverse-lengthwise-transverse growth of diffusion zone, the formation of new intermetallic compounds and thickening of diffusion zone.

Interfacial Microstructure Evolution of (B, Al)N Films Grown on Diamond Substrates

2011 ◽  
Vol 519 (13) ◽  
pp. 4212-4215 ◽  
Author(s):  
Jen-Hao Song ◽  
Jow-Lay Huang ◽  
James C. Sung ◽  
Sheng-Chang Wang ◽  
Horng-Hwa Lu ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Interfacial Microstructure
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