Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects

Materials Today Proceedings ◽

10.1016/j.matpr.2020.12.1182 ◽

2021 ◽

Vol 43 ◽

pp. 3874-3879

Author(s):

Takshashila Pathade ◽

Yash Agrawal ◽

Rutu Parekh ◽

Vinay Palaparthy

Keyword(s):

Carbon Nanotubes ◽

Signal Integrity ◽

On Chip ◽

Integrity Analysis

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Signal integrity analysis of carbon-based on-chip nano-interconnects

2012 IEEE 16th Workshop on Signal and Power Integrity (SPI) ◽

10.1109/sapiw.2012.6222914 ◽

2012 ◽

Author(s):

A. G. Chiariello ◽

A. Maffucci ◽

G. Miano

Keyword(s):

Signal Integrity ◽

On Chip ◽

Integrity Analysis ◽

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A 6.4Gbps on-chip eye opening monitor circuit for signal integrity analysis of high speed channel

2008 IEEE International Symposium on Electromagnetic Compatibility ◽

10.1109/isemc.2008.4652099 ◽

2008 ◽

Author(s):

Minchul Shin ◽

Jongjoo Shim ◽

Jaemin Kim ◽

Jun So Pak ◽

Chulsoon Hwang ◽

...

Keyword(s):

Signal Integrity ◽

Eye Opening ◽

On Chip ◽

Integrity Analysis

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An On-Chip Monitoring Circuit for Signal-Integrity Analysis of 8-Gb/s Chip-to-Chip Interfaces With Source-Synchronous Clock

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/tvlsi.2016.2639289 ◽

2017 ◽

Vol 25 (4) ◽

pp. 1386-1396 ◽

Author(s):

Pil-Ho Lee ◽

Han-Yeol Lee ◽

Hyun-Bae Lee ◽

Young-Chan Jang

Keyword(s):

Signal Integrity ◽

On Chip ◽

Integrity Analysis

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Signal integrity analysis of carbon nanotube on-chip interconnects

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089842 ◽

2009 ◽

Author(s):

A.G. Chiariello ◽

A. Maffucci ◽

G. Miano

Keyword(s):

Carbon Nanotube ◽

Signal Integrity ◽

On Chip ◽

Integrity Analysis

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Carbon nanotubes based on-chip supercapacitors with improved areal energy density

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ◽

10.1109/estc48849.2020.9229835 ◽

2020 ◽

Author(s):

Chengjun Yu ◽

Xuyuan Chen

Keyword(s):

Carbon Nanotubes ◽

Energy Density ◽

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Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680900 ◽

2018 ◽

Author(s):

Surender Singh ◽

Ashish Gupta

Keyword(s):

Signal Integrity ◽

High Density ◽

Next Generation ◽

Integrity Analysis

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Integral power net integrity analysis of a packaged u-Controller system including the u-Controller on-chip power net distribution

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089866 ◽

2009 ◽

Author(s):

Ekkehard Miersch ◽

Mehmet Goekcen ◽

Thomas Steinecke

Keyword(s):

Integral Power ◽

On Chip ◽

Integrity Analysis

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UWB on-chip fingerprinting and identification using carbon nanotubes

2014 IEEE International Conference on Ultra-WideBand (ICUWB) ◽

10.1109/icuwb.2014.6959026 ◽

2014 ◽

Author(s):

Mohamed Kheir ◽

Heinz Kreft ◽

Reinhard Knochel

Keyword(s):

Carbon Nanotubes ◽

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Machine Learning Based Design Space Exploration and Applications to Signal Integrity Analysis of 112Gb SerDes Systems

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00201 ◽

2021 ◽

Author(s):

Alex Manukovsky ◽

Yuriy Shlepnev ◽

Zurab Khasidashvili

Keyword(s):

Machine Learning ◽

Design Space Exploration ◽

Design Space ◽

Space Exploration ◽

Signal Integrity ◽

Integrity Analysis

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Statistical Signal Integrity Analysis and Diagnosis Methodology for High-Speed Systems

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2004.831856 ◽

2004 ◽

Vol 27 (4) ◽

pp. 611-629 ◽

Author(s):

E. Matoglu ◽

N. Pham ◽

D.N. deAraujo ◽

M. Cases ◽

M. Swaminathan

Keyword(s):

Signal Integrity ◽

Integrity Analysis

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