Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications

Author(s):  
Surender Singh ◽  
Ashish Gupta
ETRI Journal ◽  
2019 ◽  
Vol 41 (5) ◽  
pp. 670-683 ◽  
Author(s):  
Hyukje Kwon ◽  
Wonok Kwon ◽  
Myeong‐Hoon Oh ◽  
Hagyoung Kim

2021 ◽  
Author(s):  
Hiroko Tokoro ◽  
Asuka Namai ◽  
Shin-ichi Ohkoshi

Recent developments in magnetic films composed of epsilon-iron oxide are introduced. The film performance is studied and improved toward the next-generation of high-density magnetic recording media.


2004 ◽  
Vol 27 (4) ◽  
pp. 611-629 ◽  
Author(s):  
E. Matoglu ◽  
N. Pham ◽  
D.N. deAraujo ◽  
M. Cases ◽  
M. Swaminathan

Author(s):  
Abhijit Dharchoudhury ◽  
David Blaauw ◽  
Shantanu Ganguly

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