Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications
2010 ◽
Vol 30
(10)
◽
pp. 2853-2856
◽
Keyword(s):
2004 ◽
Vol 27
(4)
◽
pp. 611-629
◽
2006 ◽
pp. 63-1-63-34