Influence of diamond wire saw slicing parameters on (010) lattice plane beta-gallium oxide single crystal wafer

2021 ◽  
Vol 133 ◽  
pp. 105939
Author(s):  
Pengcheng Gao ◽  
Baimei Tan ◽  
Fan Yang ◽  
Hui Li ◽  
Na Bian ◽  
...  
Keyword(s):  
Single Crystal ◽  
Gallium Oxide ◽  
Lattice Plane ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Crystal Wafer

Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

2010 ◽  
Vol 431-432 ◽  
pp. 265-268 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
R Value ◽  
Material Removal Mode

Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.

scholarly journals Optimization of Machining Parameters of SiC Single Crystal Cut by Diamond Wire Saw

2018 ◽  
Vol 232 ◽  
pp. 03002 ◽  
Author(s):  
Lun Li ◽  
Shaodong Yang ◽  
Jishun Li
Keyword(s):  
Single Crystal ◽  
Process Parameters ◽  
Grey System Theory ◽  
Orthogonal Experimental Design ◽  
Feed Speed ◽  
Machining Parameters ◽  
Grey System ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw

For the process of optimizing the process parameters in the process of cutting the hard and brittle materials such as single-crystal SiC by diamond wire saw, the process parameters such as wire saw speed, workpiece feed speed and workpiece rotation speed are the design variables, and the sawing force and surface roughness are the processing targets by orthogonal experimental design. The grey system theory is introduced to optimize the multi-objective cutting process. According to the experimental data, the grey correlation resolution coefficient is determined. The significant relationship between the processing parameters and the target characteristics is analyzed. The optimal combination of process parameters under multi-target conditions is obtained, namely the workpiece feed rate is 0.025mm/min, the wire saw speed is 1.6m/s, and the workpiece rotating speed is 16r/min.

Optimization of Slicing Parameters of Single Crystal Silicon Sliced by Diamond Wire Saw

2012 ◽  
Vol 500 ◽  
pp. 89-93 ◽  
Author(s):  
J.F. Meng ◽  
Y.P. Han
Keyword(s):  
Single Crystal ◽  
Random Vibration ◽  
Single Crystal Silicon ◽  
Machine Precision ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Feed Force ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Moving Speed

The slicing technology of hard-brittle materials by endless diamond wire saw has the advantages of higher moving speed of wire saw, better slicing quality, and thin kerf. According to the strength of wire saw, the cutting force and the random vibration of wire saw, the slicing parameters are optimized. As single crystal silicon is sliced, the constant feed force is less than 10N, the maximum pretension is 30N, and the highest moving speed of wire saw is 24m/s. But because the restrict of machine precision, the highest slicing speed is 16m/s.

Al2O3 and CaO as sintering aids: A strategy to remove impurity boron and SiO2 surface-layer of diamond wire saw silicon waste

2021 ◽  
Vol 270 ◽  
pp. 118823
Author(s):  
Guangyu Chen ◽  
Yan Li ◽  
Wang Sheng ◽  
Liuqing Huang ◽  
Lizhi Tang ◽  
...  
Keyword(s):  
Surface Layer ◽  
Sintering Aids ◽  
Diamond Wire ◽  
Sio2 Surface ◽  
Wire Saw ◽  
Diamond Wire Saw
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