scholarly journals Optimization of Machining Parameters of SiC Single Crystal Cut by Diamond Wire Saw

2018 ◽  
Vol 232 ◽  
pp. 03002 ◽  
Author(s):  
Lun Li ◽  
Shaodong Yang ◽  
Jishun Li
Keyword(s):  
Single Crystal ◽  
Process Parameters ◽  
Grey System Theory ◽  
Orthogonal Experimental Design ◽  
Feed Speed ◽  
Machining Parameters ◽  
Grey System ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw

For the process of optimizing the process parameters in the process of cutting the hard and brittle materials such as single-crystal SiC by diamond wire saw, the process parameters such as wire saw speed, workpiece feed speed and workpiece rotation speed are the design variables, and the sawing force and surface roughness are the processing targets by orthogonal experimental design. The grey system theory is introduced to optimize the multi-objective cutting process. According to the experimental data, the grey correlation resolution coefficient is determined. The significant relationship between the processing parameters and the target characteristics is analyzed. The optimal combination of process parameters under multi-target conditions is obtained, namely the workpiece feed rate is 0.025mm/min, the wire saw speed is 1.6m/s, and the workpiece rotating speed is 16r/min.

Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon

2011 ◽  
Vol 175 ◽  
pp. 72-76 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge
Keyword(s):  
Single Crystal ◽  
Process Parameters ◽  
Silicon Crystal ◽  
Single Crystal Silicon ◽  
Feed Speed ◽  
Crystal Silicon ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cut Depth ◽  
Fixed Abrasive

A mathematical model to calculate the grit average cut depth in wire sawing single crystal silicon was founded. So the grit average cut depths were calculated theoretically by choosing different process parameters, and influences of process parameters on grit cut depths of slicing silicon crystal were analyzed. Analysis results indicate that the grit average cut depth relates to the silicon mechanical properties, grit shape and size, wire speed and ingot feed speed, etc. And there is a monotone increasing non-linear correlation between grit average cut depth and the ratio i value of ingot feed speed and wire speed, when the i value is lower, the average grit cut depth is lower.

Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

2010 ◽  
Vol 431-432 ◽  
pp. 265-268 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
R Value ◽  
Material Removal Mode

Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.

Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer

2010 ◽  
Vol 450 ◽  
pp. 296-299 ◽  
Author(s):  
Xiao Ye Wang ◽  
Yan Li ◽  
Shu Juan Li
Keyword(s):  
Surface Quality ◽  
Tangential Force ◽  
Cutting Speed ◽  
Work Piece ◽  
Feed Speed ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Sic Wafer

The experiment that WXD170-type reciprocating rotating diamond wire saw cuts SiC wafer was studied using orthogonal test method in this paper. The influence of cutting speed of diamond wire saw, work-piece feed speed and rotating speed of work-piece on cutting process were analyzed. The optimized cutting parameters which can improve surface quality of slices and reduce tangential force were obtained. The results show that: the surface quality of slices which was cloud-shaped can be improved significantly due to the increase of the work-piece rotation. The work-piece feed speed and the rotation speed have greater impact on the tangential force than the saw wire speed; the work-piece feed speed and the work-piece rotation speed have greater impact on surface roughness than the saw wire speed. An important way to be obtained the smaller tangential force and better surface quality of slices is considering of a reasonable match among cutting speed of diamond wire saw, work-piece feed speed and rotating speed of work-piece comprehensively.

A Spraying Method for Development of Diamond Wire Saw

2011 ◽  
Vol 175 ◽  
pp. 249-253
Author(s):  
Chun Yan Yao ◽  
Jin Sheng Wang ◽  
Wei Peng
Keyword(s):  
Removal Rate ◽  
Rotation Frequency ◽  
Work Piece ◽  
Feed Speed ◽  
Ultraviolet Curing ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Novel Method ◽  
Selection Of

Slicing the wafers with diamond wire saw is recently paid much attention. This study proposes a novel method for developing a kind of diamond wire saws with ultraviolet curing resin and spraying technique. The process of wire saw manufacturing and the selection of optimal parameters are introduced. The experiments of the slicing marble are carried out using different diamond wire saws. The effects of wire saw running speed, work-piece in-feed speed, work-piece rotation frequency on the material removal rate, and surface roughness were investigated. Result shows that new method for development of diamond wire saw is feasible.

Experimental Investigations On Optimizing Manufacturing Parameters For Electro-Spark Deposition Diamond Wire Saw

2021 ◽  
Author(s):  
Chengyun Li ◽  
Peiqi Ge ◽  
Wenbo Bi ◽  
Qihao Wang
Keyword(s):  
Electrode Materials ◽  
Optimal Parameter ◽  
High Hardness ◽  
Experimental Investigations ◽  
Pulse Interval ◽  
Feed Speed ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Validation Experiment

Abstract The third generation of superhard semiconductor materials, represented by single-crystal SiC, is used widely in microelectronics due to their excellent physical and mechanical properties. However, their high hardness and brittleness become the bottleneck of their development. Diamond wire saw (DWS) has become the mainstream tool for sawing hard and brittle crystal materials. However, the diamond abrasive is consolidated on the core wire through resin or electroplated nickel, and the holding strength is not high. When sawing superhard crystal materials, the efficiency is low. In order to improve the sawing efficiency of superhard crystal materials, it is of great significance to improve the wear resistance of wire saw and the holding strength of abrasive particles. Electro-spark deposition (ESD) can deposit electrode materials on the substrate with low heat input to achieve metallurgical bonding between metal materials. It can effectively improve the gripping strength of the abrasive grains. And the sawing ability of the wire saw to make the consolidated DWS by the ESD process. In this paper, the ESD equipment has been designed according to the characteristics of the ESDDWS process. The discharge gap size and electrode consumption are monitored in real-time by a single-chip microcomputer (SCM). Orthogonal experiments were carried out for the two motion modes. The effects of process parameters, such as (A) Grain size, (B) Abrasive content, (C) Pulse duration time, (D) Compacting pressure, (E) Current, (F) Electrode diameter, (G) Pulse interval time, (H) Reciprocating times, (I) Wire feed speed, on the quality of ESDDWS were analyzed. Through the extremum difference analysis, the optimal parameter combinations of ESDDWS were obtained. The results of the validation experiment are better than the original experimental results.

Study on Surface Quality and Machining Efficiency of Diamond Wire Saw Slicing SiCp-Al Composites

2014 ◽  
Vol 1004-1005 ◽  
pp. 1295-1298
Author(s):  
Chun Yan Zhang ◽  
Wu Yang ◽  
Yuan Sun
Keyword(s):  
Surface Quality ◽  
Future Research ◽  
Basic Rule ◽  
Feed Speed ◽  
Machining Efficiency ◽  
Machined Surface ◽  
Diamond Wire ◽  
Speed Increase ◽  
Wire Saw ◽  
Diamond Wire Saw

In order to study the basic rule of diamond wire saw slicing SiCp-Al composites, the theoretical analysis and experiments were carried out. The influences of diamond wire saw slicing speed and workpiece feed speed on surface quality and machining efficiency were discussed. The analysis results show that the machined surface gets smoother when diamond wire saw slicing speed changes from 2m/s to 3.5m/s, but gets rougher when diamond wire saw slicing speed changes from 3.5m/s to 4m/s. And the surface gets rougher when workpiece feed speed changes from 0.5m/s to 1m/s.The machining efficiency gets higher when diamond wire saw slicing speed and workpiece feed speed increase. These results provide guidance for selecting reasonable parameters in future research.

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