Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries

2022 ◽  
Vol 141 ◽  
pp. 106418
Author(s):  
Zhengzheng Bu ◽  
Fengli Niu ◽  
Jiapeng Chen ◽  
Zhenlin Jiang ◽  
Wenjun Wang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Silicon Wafer ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Single Crystal Silicon Wafer ◽  
Wafer Polishing

Simulation of near-Crack-Tip Strain Fields on Single-Crystal Silicon Wafer

2012 ◽  
Vol 430-432 ◽  
pp. 404-407
Author(s):  
J.J. Li ◽  
C.W. Zhao ◽  
Y.M. Xing ◽  
Z.Y. Lv ◽  
Y.G. Du
Keyword(s):  
Single Crystal ◽  
Silicon Wafer ◽  
Single Crystal Silicon ◽  
Crack Tip ◽  
Tensile Load ◽  
Crystal Silicon ◽  
Strain Fields ◽  
Single Crystal Silicon Wafer ◽  
Linear Elastic ◽  
Technological Developments

The failure components made of silicon is an important issue in the electronic and nano-technological developments. A study on the near-crack-tip deformation of single-crystal silicon wafer under tensile load was presented. The strain formulas around the crack tip of mode I crack were deduced from linear elastic fracture mechanics. The strain fields around the crack tip were simulated and analyzed in detail.

scholarly journals Residual Stress of TiNi Shape Memory Alloy Thin Films with (111) Single-crystal Silicon Wafer

2002 ◽  
Vol 43 (3) ◽  
pp. 566-570 ◽  
Author(s):  
Tingbin Wu ◽  
Bohong Jiang ◽  
Xuan Qi ◽  
Yushu Liu ◽  
Dong Xu ◽  
...  
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Shape Memory Alloy ◽  
Single Crystal ◽  
Shape Memory ◽  
Silicon Wafer ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Single Crystal Silicon Wafer

117303 Fracture Toughness on Cleavage Plane of Single Crystal Silicon Wafer

2011 ◽  
Vol 2011.17 (0) ◽  
pp. 29-30
Author(s):  
Satoshi SUTO ◽  
Masayoshi MIYASAKA ◽  
Junichi SHIBUGUCHI ◽  
Masayoshi TATENO
Keyword(s):  
Fracture Toughness ◽  
Single Crystal ◽  
Silicon Wafer ◽  
Cleavage Plane ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Single Crystal Silicon Wafer
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