Nanocrystalline spinel zinc-substituted cobalt ferrite thick film an efficient ethanol sensor

2021 ◽  
Vol 22 ◽  
pp. 100607
Author(s):  
R.R. Powar ◽  
V.G. Parale ◽  
V.D. Phadtare ◽  
S.B. Wategaonkar ◽  
R.K. Mane ◽  
...  
2003 ◽  
Vol 15 (20) ◽  
pp. 1589-1597 ◽  
Author(s):  
Yuan Gee Lee ◽  
Tse-Chuan Chou
Keyword(s):  

2012 ◽  
Vol 5 (2) ◽  
pp. 441-457 ◽  
Author(s):  
N. K. Pawar ◽  
D. D. Kajale ◽  
G. E. Patil ◽  
V. G. Wagh ◽  
V. B. Gaikwad ◽  
...  
Keyword(s):  

2016 ◽  
Author(s):  
M. P. Mahabole ◽  
M. A. Lakhane ◽  
A. L. Choudhari ◽  
R. S. Khairnar

Author(s):  
S. Khadpe ◽  
R. Faryniak

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.


2011 ◽  
Vol 131 (7) ◽  
pp. 484-489 ◽  
Author(s):  
Shinya Okazaki ◽  
Asako Takeuchi ◽  
Akihiro Takeshima ◽  
Makoto Sonehara ◽  
Toshiro Sato ◽  
...  
Keyword(s):  

1977 ◽  
Vol 5 (1) ◽  
pp. 6-28 ◽  
Author(s):  
A. L. Browne

Abstract An analytical tool is presented for the prediction of the effects of changes in tread pattern design on thick film wet traction performance. Results are reported for studies in which the analysis, implemented on a digital computer, was used to determine the effect of different tread geometry features, among these being the number, width, and lateral spacing of longitudinal grooves and the angle of zigzags in longitudinal grooves, on thick film wet traction. These results are shown to be in good agreement with experimental data appearing in the literature and are used to formulate guidelines for tread groove network design practice.


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