scholarly journals Preparation and properties of MWCNTs-BNNSs/epoxy composites with high thermal conductivity and low dielectric loss

2020 ◽  
Vol 24 ◽  
pp. 100985 ◽  
Author(s):  
Rui Wang ◽  
Congzhen Xie ◽  
Shoukang Luo ◽  
Huasong Xu ◽  
Bin Gou ◽  
...  
2020 ◽  
Vol 46 (6) ◽  
pp. 8431-8437
Author(s):  
Pei Yang ◽  
Lixiang Wang ◽  
Weihua Zhao ◽  
Laixin Cai ◽  
Yongbao Feng

RSC Advances ◽  
2016 ◽  
Vol 6 (86) ◽  
pp. 83163-83174 ◽  
Author(s):  
Hailin Mo ◽  
Genlin Wang ◽  
Fei Liu ◽  
Pingkai Jiang

Two strategies, including in situ grafting chemicals and polymer coating micas, were used to improve the interface between mica and epoxy matrix. The epoxy composites prepared by strategy I exhibited better overall performance.


2021 ◽  
Vol 269 ◽  
pp. 115171
Author(s):  
A.S. Osipov ◽  
P. Klimczyk ◽  
P. Rutkowski ◽  
Y.A. Melniychuk ◽  
L.O. Romanko ◽  
...  

2020 ◽  
Vol 186 ◽  
pp. 107915 ◽  
Author(s):  
Yong Sik Yeom ◽  
Kie Yong Cho ◽  
Heun Young Seo ◽  
Jong Suk Lee ◽  
Do Hyun Im ◽  
...  

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.


RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.


Polymers ◽  
2020 ◽  
Vol 12 (2) ◽  
pp. 426 ◽  
Author(s):  
Yunjian Wu ◽  
Xiaoxing Zhang ◽  
Ankit Negi ◽  
Jixiong He ◽  
Guoxiong Hu ◽  
...  

Polymer composites, with both high thermal conductivity and high electrical insulation strength, are desirable for power equipment and electronic devices, to sustain increasingly high power density and heat flux. However, conventional methods to synthesize polymer composites with high thermal conductivity often degrade their insulation strength, or cause a significant increase in dielectric properties. In this work, we demonstrate epoxy nanocomposites embedded with silver nanoparticles (AgNPs), and modified boron nitride nanosheets (BNNSs), which have high thermal conductivity, high insulation strength, low permittivity, and low dielectric loss. Compared with neat epoxy, the composite with 25 vol% of binary nanofillers has a significant enhancement (~10x) in thermal conductivity, which is twice of that filled with BNNSs only (~5x), owing to the continuous heat transfer path among BNNSs enabled by AgNPs. An increase in the breakdown voltage is observed, which is attributed to BNNSs-restricted formation of AgNPs conducting channels that result in a lengthening of the breakdown path. Moreover, the effects of nanofillers on dielectric properties, and thermal simulated current of nanocomposites, are discussed.


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