Recent advances in curved image sensor arrays for bioinspired vision system

Nano Today ◽  
2022 ◽  
Vol 42 ◽  
pp. 101366
Author(s):  
Wenchao Gao ◽  
Zhangsheng Xu ◽  
Xun Han ◽  
Caofeng Pan
Keyword(s):  
Vision System ◽  
Sensor Arrays ◽  
Image Sensor ◽  
Recent Advances

Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000015-000022
Author(s):  
Paul Enquist
Keyword(s):  
Low Temperature ◽  
Sensor Arrays ◽  
Cost Savings ◽  
Image Sensor ◽  
Network On Chip ◽  
Wafer Scale ◽  
Direct Bond ◽  
3D Network ◽  
On Chip ◽  
3D Volume

3D microelectronics integration and wafer scale packaging promise improvements in functional density and cost compared to conventional 2D microelectronics and packaging technologies. The realization of these improvements will require further adoption of 3D volume manufacturing process technologies. These process technologies will likely include through silicon via (TSV) and die or wafer bonding with and without 3D interconnect. Low temperature direct bond technologies have a number of inherent performance and cost advantages compared to other bonding technologies. This paper describes low temperature direct oxide bond technologies with and without a scalable 3D interconnect developed by Ziptronix and cost savings, performance and applications that will be enabled by adoption of these technologies. Enabled cost savings and performance include system or network-on-chip, system in package, and TSVs. Enabled applications include backside illuminated image sensors, micron-scale pitch vertically integrated image sensor arrays, 3D system-on-chip and 3D network-on-chip.

Direct laser-patterned MXene–perovskite image sensor arrays for visible-near infrared photodetection

2020 ◽  
Vol 7 (7) ◽  
pp. 1901-1911 ◽  
Author(s):  
Aobo Ren ◽  
Jihua Zou ◽  
Huagui Lai ◽  
Yixuan Huang ◽  
Liming Yuan ◽  
...  
Keyword(s):  
Near Infrared ◽  
Performance Metrics ◽  
State Of The Art ◽  
Sensor Arrays ◽  
Image Sensor ◽  
Top Down ◽  
Solution Processed ◽  
Direct Laser ◽  
Infrared Photodetection ◽  
Art Performance

Solution-processed MXene–perovskite image sensor arrays are realized by a top-down method, which combine desirable manufacturing advantages and state-of-the-art performance metrics.

scholarly journals Recent Advances in Aerosol and Trace Gas Monitoring by Employing the Scheimpflug Lidar Techniques

2020 ◽  
Vol 237 ◽  
pp. 07022
Author(s):  
Liang Mei ◽  
Zheng Kong ◽  
Teng Ma ◽  
Zhi Liu ◽  
Zhenfeng Gong ◽  
...  
Keyword(s):  
Continuous Wave ◽  
Laser Diodes ◽  
Image Sensor ◽  
Trace Gas ◽  
Light Sources ◽  
Continuous Wave Laser ◽  
Gas Monitoring ◽  
Power Laser ◽  
Recent Advances ◽  
Atmospheric Remote Sensing

Lidar techniques, based on the time-of-flight principle, have been widely employed in atmospheric remote sensing since decades. The Scheimpflug lidar (SLidar) technique, which employing robust high-power laser diodes as light sources and highly integrated CCD/CMOS image sensor as detectors, has been recently developed for various atmospheric applications. Range-resolved atmospheric backscattering signal is obtained by capturing the backscattering imaging of transmitted continuous-wave laser beam based on the Scheimpflug principle. This paper reported recent advances in aerosol and trace gas monitoring by employing the SLidar techniques.

Smart CMOS image sensor arrays

1997 ◽  
Vol 44 (10) ◽  
pp. 1699-1705 ◽  
Author(s):  
M. Schanz ◽  
W. Brockherde ◽  
R. Hauschild ◽  
B.J. Hosticka ◽  
M. Schwarz
Keyword(s):  
Sensor Arrays ◽  
Cmos Image Sensor ◽  
Image Sensor

Thin-film circuits for scanning image-sensor arrays

1968 ◽  
Vol 15 (4) ◽  
pp. 215-219 ◽  
Author(s):  
G. Sadasiv ◽  
P.K. Weimer ◽  
W.S. Pike
Keyword(s):  
Thin Film ◽  
Sensor Arrays ◽  
Image Sensor

Performance improvement of CCD image sensor arrays

2000 ◽  
Vol 29 (5) ◽  
pp. 303-306
Author(s):  
V. A. Arutyunov ◽  
O. V. Sorokin
Keyword(s):  
Performance Improvement ◽  
Sensor Arrays ◽  
Image Sensor ◽  
Ccd Image Sensor ◽  
Ccd Image

Two-dimensional amorphous silicon image sensor arrays

1996 ◽  
Vol 198-200 ◽  
pp. 1151-1154 ◽  
Author(s):  
R.A. Street ◽  
X.D. Wu ◽  
R. Weisfield ◽  
S. Ready ◽  
R. Apte ◽  
...  
Keyword(s):  
Amorphous Silicon ◽  
Sensor Arrays ◽  
Image Sensor ◽  
Two Dimensional

scholarly journals Networking retinomorphic sensor with memristive crossbar for brain-inspired visual perception

2020 ◽  
Author(s):  
Shuang Wang ◽  
Chen-Yu Wang ◽  
Pengfei Wang ◽  
Cong Wang ◽  
Zhu-An Li ◽  
...  
Keyword(s):  
Visual Perception ◽  
Large Scale ◽  
Vision System ◽  
Image Sensor ◽  
Letter Recognition ◽  
Human Vision ◽  
Large Power ◽  
Image Sensing ◽  
Conventional Machine ◽  
Neuromorphic Vision

Abstract Compared to human vision, conventional machine vision composed of an image sensor and processor suffers from high latency and large power consumption due to physically separated image sensing and processing. A neuromorphic vision system with brain-inspired visual perception provides a promising solution to the problem. Here we propose and demonstrate a prototype neuromorphic vision system by networking a retinomorphic sensor with a memristive crossbar. We fabricate the retinomorphic sensor by using WSe2/h-BN/Al2O3 van der Waals heterostructures with gate-tunable photoresponses, to closely mimic the human retinal capabilities in simultaneously sensing and processing images. We then network the sensor with a large-scale Pt/Ta/HfO2/Ta one-transistor-one-resistor (1T1R) memristive crossbar, which plays a similar role to the visual cortex in the human brain. The realized neuromorphic vision system allows for fast letter recognition and object tracking, indicating the capabilities of image sensing, processing and recognition in the full analog regime. Our work suggests that such a neuromorphic vision system may open up unprecedented opportunities in future visual perception applications.

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