High-aspect-ratio ZnSe microstructure generated by spatially shaped femtosecond laser writing assisted with wet chemical etching

2022 ◽  
Vol 147 ◽  
pp. 107687
Author(s):  
Sikun Zhou ◽  
Li Shen ◽  
Fangjie Wang ◽  
Yue Li ◽  
Hong Zhang ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Femtosecond Laser ◽  
High Aspect Ratio ◽  
Chemical Etching ◽  
Laser Writing ◽  
Wet Chemical ◽  
Wet Chemical Etching

Laminar flow used as “liquid etch mask” in wet chemical etching to generate glass microstructures with an improved aspect ratio

Lab on a Chip ◽  
2009 ◽  
Vol 9 (14) ◽  
pp. 1994 ◽  
Author(s):  
Xuan Mu ◽  
Qionglin Liang ◽  
Ping Hu ◽  
Kangning Ren ◽  
Yiming Wang ◽  
...  
Keyword(s):  
Laminar Flow ◽  
Aspect Ratio ◽  
Chemical Etching ◽  
Wet Chemical ◽  
Wet Chemical Etching

Femtosecond-laser-assisted wet chemical etching of polymer materials

2006 ◽  
Vol 100 (2) ◽  
pp. 1229-1238 ◽  
Author(s):  
C. Wochnowski ◽  
Y. Hanada ◽  
Y. Cheng ◽  
S. Metev ◽  
F. Vollertsen ◽  
...  
Keyword(s):  
Femtosecond Laser ◽  
Chemical Etching ◽  
Polymer Materials ◽  
Wet Chemical ◽  
Wet Chemical Etching

Decapsulation Techniques for Cu Wire Bonding Package

2009 ◽  
Author(s):  
Dongmei Meng ◽  
Joe Rupley ◽  
Chris McMahon
Keyword(s):  
Laser Ablation ◽  
Thin Layer ◽  
Chemical Etching ◽  
Wire Bonding ◽  
Methods And Techniques ◽  
Wet Chemical ◽  
Wet Chemical Etching ◽  
Reliability Issue ◽  
Etch Time ◽  
Device Technology

Abstract This paper presents decapsulation solutions for devices bonded with Cu wire. By removing mold compound to a thin layer using a laser ablation tool, Cu wire bonded packages are decapsulated using wet chemical etching by controlling the etch time and temperature. Further, the paper investigates the possibilities of decapsulating Cu wire bonded devices using full wet chemical etches without the facilitation of laser ablation removing much of mold compound. Additional discussion on reliability concerns when evaluating Cu wirebond devices is addressed here. The lack of understanding of the reliability of Cu wire bonded packages creates a challenge to the FA engineer as they must develop techniques to help understanding the reliability issue associated with Cu wire bonding devices. More research and analysis are ongoing to develop appropriate analysis methods and techniques to support the Cu wire bonding device technology in the lab.

scholarly journals Controlling the Facet of ZnO during Wet Chemical Etching Its (0001) O‐Terminated Surface

Small ◽  
2020 ◽  
Vol 16 (51) ◽  
pp. 2007045
Author(s):  
Mei Sun ◽  
Bocheng Yu ◽  
Mengyu Hong ◽  
Zhiwei Li ◽  
Fengjiao Lyu ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Wet Chemical ◽  
Wet Chemical Etching

scholarly journals In Situ Study of the Wet Chemical Etching of SiO2 and Nanoparticle@SiO2 Core–Shell Nanospheres

2021 ◽  
Author(s):  
Albert Grau-Carbonell ◽  
Sina Sadighikia ◽  
Tom A. J. Welling ◽  
Relinde J. A. van Dijk-Moes ◽  
Ramakrishna Kotni ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Core Shell ◽  
In Situ Study ◽  
Wet Chemical ◽  
Wet Chemical Etching

Controllable end shape modification of ZnO nano-arrays/rods by a simple wet chemical etching technique

2015 ◽  
Vol 48 (36) ◽  
pp. 365303 ◽  
Author(s):  
Jingchang Sun ◽  
Ting Zhao ◽  
Zhangwei Ma ◽  
Ming Li ◽  
Cheng Chang ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Shape Modification ◽  
Etching Technique ◽  
Wet Chemical ◽  
Wet Chemical Etching
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