scholarly journals High-speed measurement method of quantized energy levels in Josephson junctions using SFQ circuits

2004 ◽  
Vol 412-414 ◽  
pp. 1546-1549 ◽  
Author(s):  
Y. Yamanashi ◽  
M. Ito ◽  
A. Tagami ◽  
N. Yoshikawa
2014 ◽  
Vol 596 ◽  
pp. 468-471
Author(s):  
Tao Hou ◽  
Duo Wang Fan ◽  
Hong Xia Niu

For the problem of a big velocity measurement error,analyzed the velocity measurement error and studied the method of improving velocity measurement accuracy for the velocity measuring system of high-speed train.In this analysis and method, the speed error analysis was carried out based on understand the characteristics of the high-speed train speed sensor, and found that there is a bigger error. Then discussed the influence of large errors of the control system, and then put forward the improved M/T speed measurement method to solve the error problem. Finally, calculated velocity-measuring error for the improved M/T speed measurement method. The results show that the accuracy of speed has improved greatly. The research method can improve the accuracy to meet the requiring of train safety and smooth run.


2021 ◽  
Vol 92 (5) ◽  
pp. 054701
Author(s):  
T. Hennen ◽  
E. Wichmann ◽  
A. Elias ◽  
J. Lille ◽  
O. Mosendz ◽  
...  

Author(s):  
Yu Hirano ◽  
Masaru Kojima ◽  
Mitsuhiro Horade ◽  
Kazuto Kamiyama ◽  
Yasushi Mae ◽  
...  

1991 ◽  
Vol 224 ◽  
Author(s):  
C. Schietinger ◽  
B. Adams ◽  
C. Yarling

AbstractA novel wafer temperature and emissivity measurement technique for rapid thermal processing (RTP) is presented. The ‘Ripple Technique’ takes advantage of heating lamp AC ripple as the signature of the reflected component of the radiation from the wafer surface. This application of Optical Fiber Thermometry (OFT) allows high speed measurement of wafer surface temperatures and emissivities. This ‘Ripple Technique’ is discussed in theoretical and practical terms with wafer data presented. Results of both temperature and emissivity measurements are presented for RTP conditions with bare silicon wafers and filmed wafers.


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