On the performance and mechanism of brominated and halogen free flame retardants in formulations of glass fibre reinforced poly(butylene terephthalate)

2014 ◽  
Vol 104 ◽  
pp. 71-86 ◽  
Author(s):  
A. Ramani ◽  
A.E. Dahoe
Keyword(s):  
Glass Fibre ◽  
Flame Retardants ◽  
Butylene Terephthalate ◽  
Glass Fibre Reinforced ◽  
Halogen Free ◽  
Performance And Mechanism

Competition in aluminium phosphinate-based halogen-free flame retardancy of poly(butylene terephthalate) and its glass-fibre composites

e-Polymers ◽  
2014 ◽  
Vol 14 (3) ◽  
pp. 193-208 ◽  
Author(s):  
Sven Brehme ◽  
Thomas Köppl ◽  
Bernhard Schartel ◽  
Volker Altstädt
Keyword(s):  
Flame Retardancy ◽  
Glass Fibre ◽  
Flame Retardants ◽  
Total Heat ◽  
Maximum Increase ◽  
Limiting Oxygen Index ◽  
Butylene Terephthalate ◽  
Cone Calorimeter Test ◽  
Maximum Decrease ◽  
Halogen Free

AbstractAluminium diethylphosphinate (AlPi-Et) and inorganic aluminium phosphinate with resorcinol-bis(di-2,6-xylyl phosphate) (AlPi-H+RXP) were compared with each other as commercially available halogen-free flame retardants in poly(butylene terephthalate) (PBT) as well as in glass-fibre-reinforced PBT (PBT/GF). Pyrolysis behaviour and flame retardancy performance are reported in detail. AlPi-H+RXP released phosphine at very low temperatures, which can become a problem during processing. AlPi-Et provided better limiting oxygen index (LOI) values and UL 94 ratings for bulk and PBT/GF than AlPi-H+RXP. Both flame retardants acted via three different flame-retardancy mechanisms in bulk as well as in PBT/GF, namely, flame inhibition, increased amount of char, and a protection effect of the char. AlPi-Et was more efficient in decreasing the total heat evolved of PBT in the cone calorimeter test. AlPi-H+RXP reduced the peak heat release rate of PBT more efficiently than AlPi-Et. An optimum loading of AlPi-Et in PBT/GF was found, which was below the supplier’s recommendation. This loading provides a maximum increase in LOI and a maximum decrease in total heat evolved.

An efficient halogen-free flame retardant for glass-fibre-reinforced poly(butylene terephthalate)

2012 ◽  
Vol 97 (2) ◽  
pp. 158-165 ◽  
Author(s):  
Li Chen ◽  
Yuan Luo ◽  
Zhi Hu ◽  
Gong-Peng Lin ◽  
Bin Zhao ◽  
...  
Keyword(s):  
Flame Retardant ◽  
Glass Fibre ◽  
Butylene Terephthalate ◽  
Glass Fibre Reinforced ◽  
Halogen Free

Fire performance of brominated and halogen-free flame retardants in glass-fiber reinforced poly(butylene terephthalate)

2017 ◽  
Vol 42 (1) ◽  
pp. 18-27 ◽  
Author(s):  
M. Suzanne ◽  
A. Ramani ◽  
S. Ukleja ◽  
M. McKee ◽  
J. Zhang ◽  
...  
Keyword(s):  
Glass Fiber ◽  
Flame Retardants ◽  
Fire Performance ◽  
Fiber Reinforced ◽  
Butylene Terephthalate ◽  
Glass Fiber Reinforced ◽  
Halogen Free

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

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