Dynamic characterization of elastomer buffer under impact loading by low-velocity drop test method

2019 ◽  
Vol 79 ◽  
pp. 106013 ◽  
Author(s):  
Ahmet Meram
SINERGI ◽  
2021 ◽  
Vol 25 (2) ◽  
pp. 135
Author(s):  
Monika Audiya Pratiwi ◽  
Muhammad Ikhsan ◽  
Rio Duzan Octavianto ◽  
Abdul Hamid ◽  
Subekti Subekti

Bearing is an essential component in a mechanical rotating equipment system. It is no less important than lubrication to prevent wear is very important to consider in the mechanical maintenance system of rotating equipment. Bearing wear is one of the problems in wind turbines that will increase maintenance costs, shorten the wind turbines' lifespan, and cause the component or overall damage to the wind turbine. The latest technology has provided instruments for analyzing the damage of elements in a bearing according to the caused vibrations. Therefore, this study was performed on Ball Bearing Turbine Propeller to identify the dynamic characteristics of Ball Bearing with and without lubrication. The test was carried out using the Bump Test method applied in three measured parts: X, Y, and Z axes. The measuring instrument which was used was Fast Fourier Transform (FFT) Analyzer (Ono Sokki) and the data were analyzed using MATLAB. It was identified that the application of oil could reduce the amplitude and decrease the frequency. Personal frequency appearing more than once indicates the existence of global vibration modes. The frequency which only appears once in the measurement spot indicates local vibration modes. The highest frequency both after and before the application of oil was found in the Y-axis.


2005 ◽  
Vol 297-300 ◽  
pp. 893-898
Author(s):  
Seung Mo Kim ◽  
Eun Sook Shon ◽  
Yoon Hyun Ka ◽  
Yong Joon Kim ◽  
Jin Young Kim ◽  
...  

Cyclic bend test and drop test were carried out as a second level reliability test method in order to characterize the joint performance between electronic components and board. Two types of package substrates were used for the test. The one was NiAu plated, and the other one was organic solderability preservatives (OSP) finished. Drop test was done in accordance with JEDEC standard test method [1]. Drop impact and duration time was 1,500G and 0.5ms, respectively. Cyclic bend test was performed with Amkor internal specification because there is no international standard for the test. The Amkor internal specification was edited based on the IPC/JEDEC specification [2]. Board deflection and cyclic frequency was 3mm and 1Hz, respectively. NiAu substrate showed better mean life performance about by 30% in cyclic bend test. OSP substrate showed the same or better failure rate performance in drop test. Typical solder joint failures and intermetalic crack were found by failure analysis.


2019 ◽  
Vol 53 (17) ◽  
pp. 2391-2405
Author(s):  
Adadé Seyth Ezéckiel Amouzou ◽  
Olivier Sicot ◽  
Ameur Chettah ◽  
Shahram Aivazzadeh

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