Solution-processable CF 3 -substituted ductile polyimides with low coefficients of thermal expansion as novel coating-type protective layers in flexible printed circuit boards
2016 ◽
Vol 99
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pp. 125-133
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2008 ◽
Vol 23
(1)
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pp. 103-109
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2009 ◽
Vol 85
(6)
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pp. 341-350
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2008 ◽
Vol 47
(5)
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pp. 4300-4304
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2008 ◽
Vol 21
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pp. 107-112
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2007 ◽
Vol 18
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pp. 017001
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2017 ◽
Vol 96
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pp. 393-402
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2013 ◽
Vol 655-657
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pp. 88-93
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