scholarly journals Investigation of Material Removal and Surface Topography Formation in Vibratory Finishing

Procedia CIRP ◽  
2014 ◽  
Vol 14 ◽  
pp. 25-30 ◽  
Author(s):  
Eckart Uhlmann ◽  
Arne Dethlefs ◽  
Alexander Eulitz
Keyword(s):  
Surface Topography ◽  
Material Removal ◽  
Vibratory Finishing

The Effects of Hardness Variation on a CMP Model of Copper thin Films

2009 ◽  
Vol 1157 ◽  
Author(s):  
Joseph Bonivel ◽  
Yusuf Williams ◽  
Sarah Blitz ◽  
Micheal Kuo ◽  
Ashok Kumar
Keyword(s):  
Mechanical Properties ◽  
Surface Topography ◽  
Material Removal Rate ◽  
Crystallographic Orientation ◽  
Chemical Mechanical Polishing ◽  
Manufacturing Process ◽  
Material Removal ◽  
Removal Rate ◽  
Mechanical Polishing ◽  
Hardness Variation

AbstractWith the rapid change of materials systems and decreased feature size, thin film microstructure and mechanical properties have become critical parameters for microelectronics reliability. An example of a major driver of this new technology is the data storage community who is pushing for 1 Terabit/square inch on its magnetic disk hard drives. This requires inherent knowledge of the mechanical properties of materials and in depth understanding of the tribological phenomena involved in the manufacturing process. Chemical mechanical polishing (CMP) is a semi-conductor manufacturing process used to remove or planarize ultra-thin metallic, dielectric, or barrier films (copper) on silicon wafers. The material removal rate (MRR), which ultimately effects the surface topography, corresponding to CMP is given by the standard Preston Equation, which contains the load applied, the velocity of the pad, the Preston coefficient which includes chemical dependencies, and the hardness of the material. Typically the hardness, a bulk material constant, is taken as a constant throughout the wafer and thereby included in the Preston coefficient. Through metallurgy studies, on the micro and nano scale, it has been proven that the hardness is dependent upon grain size and orientation. This research served to first relate the crystallographic orientation to a specific hardness value and secondly use the hardness variation in the previously developed particle augmented mixed-lubrication (PAML) model to simulate the surface topography and MRR during CMP. Recent test and results show that currently there is no empirical formula to relate the crystallographic orientation and thereby a critically resolved shear stress (CRSS) to a specific hardness value. The second part of this investigation utilized the variation in hardness values from the initial study and incorporated these results into the PAML numerical model that incorporates all the physics of chemical mechanical polishing (CMP). Incorporation of the variation of hardness resulted in a surface topography with a difference in roughness (Ra) from the bulk constant hardness value of 60 nm. The material removal rate (MRR) of the process differs by 2.17 μm3/s.

Surface Topography Characteristics in Ultrasonic Aided High Speed Lapping of Engineering Ceramics

2008 ◽  
Vol 53-54 ◽  
pp. 273-278
Author(s):  
Feng Jiao ◽  
Bo Zhao ◽  
T.P. Li ◽  
Y. Zhao
Keyword(s):  
Surface Topography ◽  
Material Removal ◽  
High Speed ◽  
Good Method ◽  
Ductile Material ◽  
Material Removal Mechanism ◽  
Engineering Ceramics ◽  
Machining Quality ◽  
The Difference ◽  
Unique Surface

Because of its high machining efficiency and good machining quality, ultrasonic aided high-speed lapping with solid abrasive is regarded as a good method of cylindrical machining for engineering ceramics. Compared with conventional lapping, ultrasonic aided high speed lapping has unique surface topography distribution characteristics for the difference of the surface formation mechanism and material removal mechanism. In the paper, the surface topography characteristics of engineering ceramics in different lapping mode were researched. Research results show that the lapped surfaces with and without ultrasonic assistance present different surface topography characteristics. Under the same lapping mode, the lapped surface topography is distinctly different for different ceramics. With the assistance of ultrasonic vibration, more ductile material removal can be obtained and the surface quality can be improved correspondingly.

Effect of Different Dielectric Fluids on Micro EDM of Low Conductivity Ceramic Material RB-SiC

2012 ◽  
Vol 565 ◽  
pp. 529-534
Author(s):  
Pay Jun Liew ◽  
Ji Wang Yan ◽  
Takeshi Masaki ◽  
Tunemoto Kuriyagawa
Keyword(s):  
Surface Topography ◽  
Material Removal Rate ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Deionized Water ◽  
Machining Process ◽  
Graphite Fiber ◽  
Dielectric Fluids ◽  
Electrolytic Corrosion

The machining characteristics of reaction bonded silicon carbide (RB-SiC) in micro electrical discharge machining process were studied by using EDM oil, deionized water, and graphite fiber mixed EDM oil as the dielectric fluids. The process performances were measured in terms of material removal rate, surface roughness and surface topography. The effect of deionized water on SUS 304 also was tried and compared with that on RB-SiC. It was found that when graphite fiber mixed EDM oil was used, higher material removal rate, better surface finish and smoother surface topography were obtained compared to that pure EDM oil and deionized water on RB-SiC. Deionized water could produce better form accuracy, however, electrolytic corrosion occurred and small pits were formed around the machining area of RB-SiC. In contrast, electrolytic corrosion was insignificant for SUS 304.

scholarly journals Analysis of Abrasives On Cutting Edge Preparation By Drag Finishing

2021 ◽  
Author(s):  
Dejin Lv ◽  
Yongguo Wang ◽  
Xin Yu ◽  
Han Chen ◽  
Yuan Gao
Keyword(s):  
Surface Roughness ◽  
Surface Topography ◽  
Material Removal ◽  
Cutting Edge ◽  
K Factor ◽  
Solid Carbide ◽  
End Mills ◽  
Cutting Edge Preparation ◽  
Drag Finishing ◽  
Edge Preparation

Abstract Cutting edge preparation has become more important for tool performance. The micro-shape, radius and surface topography of the cutting edge plays a significant role in the machining process. The cutting edge of solid carbide end mills have some micro-defects after grinding. For eliminating aforementioned problem, this study investigates drag finishing (DF) preparation for solid carbide end mills reconstruct cutting edge micro-geometry. This paper is to present the design of DF experimental set-up and analysis the characterization of various abrasive media (K3/600, K3/400, HSC 1/300 and HSO 1/100) on the evolution of the surface /roughness along the cutting edge. In parallel, the mechanism of material removal and the kinematics trajectory of the drag finishing are presented. In fact, the form factor (also called as “K-factor”) of the cutting edge micro-geometry is quantified. Comparing with four lapping media, the higher material removal rate (MRR) and the lower surface roughness are obtained by HSO 1/100 abrasive process. The results show that the cutting edge K-factor, MRR and surface topography are influenced by the abrasive particles size, composition and process time. The cutting edge micro-geometry is measured through Scanning Electron Microscopy (SEM) and 3D Optical measuring instrument.

Microscopic contact pressure and material removal modeling in rail grinding using abrasive belt

2020 ◽  
Vol 235 (1-2) ◽  
pp. 3-12
Author(s):  
Wengang Fan ◽  
Wenxi Wang ◽  
Junda Wang ◽  
Xinle Zhang ◽  
Chang Qian ◽  
...  
Keyword(s):  
Surface Topography ◽  
Contact Pressure ◽  
Material Removal ◽  
Normal Load ◽  
Great Influence ◽  
Theoretical Models ◽  
Contact Behavior ◽  
Abrasive Belt ◽  
Grinding Method ◽  
Rail Grinding

Recently, the emerging rail grinding method using abrasive belt has been proposed to efficiently achieve the required geometric profile and the surface quality of the railhead. Although the abrasive features indeed have a great influence on this rail grinding process, the surface topography of abrasive belt regarding grits at the microscopic scale is neglected. In this article, a microscopic contact pressure model was developed to reveal the contact behavior of every active grit based on the digital representation of the surface topography of abrasive belt. Then a numerical model of material removal quantity was also established based on the consideration of the characteristics of abrasive grits and their interactions. Finally, the series of finite element simulations and grinding tests were successively implemented. The normal load and the surface topography of abrasive belt significantly affected the microscopic contact behavior of grits, thus confirming the proposed theoretical models of microscopic contact pressure and material removal quantity.

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