Achieving exceptional creep resistance in rare-earth-free Mg-base alloys by engineering the shape, size and fraction of eutectic, particles and precipitates

2019 ◽  
Vol 162 ◽  
pp. 121-126 ◽  
Author(s):  
N.T.B.N. Koundinya ◽  
Ravi Sankar Kottada
2016 ◽  
Vol 675 ◽  
pp. 65-75 ◽  
Author(s):  
S. Gavras ◽  
S.M. Zhu ◽  
J.F. Nie ◽  
M.A. Gibson ◽  
M.A. Easton

2007 ◽  
Vol 539-543 ◽  
pp. 1719-1722 ◽  
Author(s):  
Li Min Wang ◽  
Qiu Ming Peng ◽  
Jie Yang ◽  
Da Qing Fang ◽  
Yao Ming Wu ◽  
...  

Magnesium (Mg) alloys are becoming one of the key engineering materials for aerospace and automotive industries because of their low density, high specific strength, excellent machinability and good diecastability, etc. In the meantime, conventional Mg alloys are limited for their low strength and creep resistance. Therefore, special attention is given on its applications at high temperature such as the transmission case and the engine block, In the near decades, much effort have been devoted to improving the properties such as strength, ductility, creep resistance of Mg alloys by adding rare earth (RE) elements, and it has been certified that the addition of RE do improve the performances of the Mg alloys. In this paper, we will review the progresses in the investigations of the Mg-RE alloys as a structural material, and also propose its application prospect in future.


2018 ◽  
Vol 14 (2) ◽  
pp. 5504-5519 ◽  
Author(s):  
Rizk Mostafa Shalaby ◽  
Musaeed Allzeleh ◽  
Mustafa Kamal

The development of lead-free solder has an urgent task for material scientist due to health and environmental concerns over the lead content of traditional solders. The objective of this study is to examine Bi-Ag-rare earth (RE) element considered as one of the more attractive lead-free solders since it can easily replace Sn-Pb eutectic alloy with increasing soldering temperature while causes for high-temperature applications. In order to enhance the soldering properties of Bi-Ag alloys, a trace eare earth (RE) element of Ho added into Bi-Ag alloys. The results indicated that the addition of RE led to the refining of coarse Bi-Ag grains, in the microstructure. The tensile strength, Hv and creep resistance increased with a decrease in melting point and electrical resistance. This paper brief the influences of rare earth alloying element and rapid solidification on both of the microstructure, intermetallic compounds, creep resistance, melting behavior, electrical resistance and mechanical behavior.


2021 ◽  
Vol 216 ◽  
pp. 108882 ◽  
Author(s):  
Youwen Yang ◽  
Mingli Yang ◽  
Chongxian He ◽  
Fangwei Qi ◽  
Di Wang ◽  
...  
Keyword(s):  

Alloy Digest ◽  
1999 ◽  
Vol 48 (12) ◽  

Abstract UCI-198 is best described as an HP alloy modified with niobium and with microalloying by titanium and rare-earth elements. The alloy was developed to produce increased creep resistance in furnace tube applications. This datasheet provides information on composition, physical properties, hardness, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as casting, machining, and joining. Filing Code: SS-770. Producer or source: Ultra-Cast Inc.


2016 ◽  
Vol 18 (6) ◽  
pp. 932-937 ◽  
Author(s):  
Suming Zhu ◽  
Mark A. Easton ◽  
Trevor B. Abbott ◽  
Mark A. Gibson ◽  
Jian-Feng Nie

2002 ◽  
Vol 17 (12) ◽  
pp. 3146-3154 ◽  
Author(s):  
C. M. L. Wu ◽  
D. Q. Yu ◽  
C. M. T. Law ◽  
L. Wang

To improve the properties of the eutectic Sn–Ag lead-free solder alloy, various amounts of mixed rare-earth (RE) elements, mainly Ce and La, were added. The microstructure, wetting properties, melting behavior, mechanical properties, and creep behavior were studied. It was revealed that RE elements can refine the intermetallics, and with 0.5% RE addition, the RE-bearing phase can be detected in the microstructure of the slow-cooled alloy. The results of differential scanning calorimetry indicate that the melting points of the RE-doped alloys are slightly lower than that of the Sn–3.5Ag and have a eutectic peak. The wetting property and creep resistance of the Sn–3.5Ag–0.25RE alloy are better than those of the Sn–3.5Ag alloy. The creep properties were studied at the temperatures of 303, 348, and 393 K, at various stress levels between 8 and 34 MPa. The stress exponents of the Sn–3.5Ag and Sn–3.5Ag–0.25RE were obtained at these temperatures. Tensile, creep, and wetting properties were found to improve with the addition of RE elements. The improvement of creep resistance is due to the fine dispersion of intermetallics and the decrease in interface energy between matrix and intermetallics. The wettability improvement is mainly due to the accumulation of RE elements at the solder/flux interface, leading to the reduction of the interfacial tension between solder and flux.


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